Functionalized mesoporous silica/polyimide nanocomposite thin films with improved mechanical properties and low dielectric constant

被引:82
作者
Min, Chun-Kuo [1 ]
Wu, Tai-Bor [1 ]
Yang, Wei-Ta [2 ]
Chen, Chi-Lun [2 ]
机构
[1] Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu 300, Taiwan
[2] Ind Technol Res Inst, Mat & Chem Labs, Hsinchu 310, Taiwan
关键词
nanocomposite; mechanic properties; thermal properties; dielectric constant;
D O I
10.1016/j.compscitech.2007.09.021
中图分类号
TB33 [复合材料];
学科分类号
摘要
A series of composite thin films composed of mesoporous silica (SBA- 15) filled in polyimide were synthesized. The effect of SBA- 15 modified with functional group of octyltrimethoxysilane (OTMS) or 3-aminopropyl trimethoxy silane (ATS) on the mechanical and dielectric properties as well as the thermal stability of thin films were investigated. The tensile strength and elongation of the composite films containing SBA-15 modified with ATS were higher than those with OTMS and pristine SBA-15. The dielectric constant was significantly reduced with increasing SBA- 15 modified with ATS. The result indicates that the composite materials are potentially useful in radio-frequency/microwave substrate materials. (C) 2007 Published by Elsevier Ltd.
引用
收藏
页码:1570 / 1578
页数:9
相关论文
共 27 条
  • [1] A REVIEW OF PARTICULATE REINFORCEMENT THEORIES FOR POLYMER COMPOSITES
    AHMED, S
    JONES, FR
    [J]. JOURNAL OF MATERIALS SCIENCE, 1990, 25 (12) : 4933 - 4942
  • [2] Structures and dielectric properties of thin polyimide films with nano-foam morphology
    Cha, HJ
    Hedrick, J
    DiPietro, RA
    Blume, T
    Beyers, R
    Yoon, DY
    [J]. APPLIED PHYSICS LETTERS, 1996, 68 (14) : 1930 - 1932
  • [3] High-performance circuit boards based on mesoporous silica filled PTFE composite materials
    Chen-Yang, YW
    Chen, CW
    Wu, YZ
    Chen, YC
    [J]. ELECTROCHEMICAL AND SOLID STATE LETTERS, 2005, 8 (01) : F1 - F4
  • [4] Physical gelation in ethylene-propylene copolymer melts induced by polyhedral oligomeric silsesquioxane (POSS) molecules
    Fu, BX
    Gelfer, MY
    Hsiao, BS
    Phillips, S
    Viers, B
    Blanski, R
    Ruth, P
    [J]. POLYMER, 2003, 44 (05) : 1499 - 1506
  • [5] Hedrick JL, 1998, ADV MATER, V10, P1049, DOI 10.1002/(SICI)1521-4095(199809)10:13<1049::AID-ADMA1049>3.0.CO
  • [6] 2-F
  • [7] HEDRICK JL, 1995, POLYMER, V36, P4855
  • [8] THE YIELD STRENGTH OF PARTICULATE REINFORCED THERMOPLASTIC COMPOSITES
    JANCAR, J
    DIANSELMO, A
    DIBENEDETTO, AT
    [J]. POLYMER ENGINEERING AND SCIENCE, 1992, 32 (18) : 1394 - 1399
  • [9] Jiang LY, 2002, ADV MATER, V14, P426, DOI 10.1002/1521-4095(20020318)14:6<426::AID-ADMA426>3.0.CO
  • [10] 2-O