Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications

被引：127

作者：

Schubert, Th. ^{[1
]}

Brendel, A. ^{[2
]}

Schmid, K. ^{[2
]}

Koeck, Th. ^{[2
]}

Ciupinski, L. ^{[3
]}

Zielinski, W. ^{[3
]}

Weissgaerber, T. ^{[1
]}

Kieback, B. ^{[1
]}

机构：

[1] Fraunhofer Inst Mfg & Adv Mat, Dept Powder Met & Composite Mat, D-01277 Dresden, Germany

[2] Max Planck Inst Plasma Phys, D-85748 Garching, Germany

[3] Warsaw Univ Technol, Fac Mat Sci & Engn, PL-02501 Warsaw, Poland

来源：

COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING | 2007年 / 38卷 / 12期

关键词：

metal-matrix composites (MMCs); particle-reinforcement; interface/interphase; thermal properties;

D O I：

10.1016/j.compositesa.2007.08.012

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In order to dissipate the heat generated in electronic packages, suitable materials must be developed as heat spreaders or heat sinks. Metal matrix composites (MMCs) offer the possibility to tailor the properties of a metal (Cu) by adding an appropriate reinforcement phase (SiC) to meet the demands for high thermal conductivities in thermal management applications. Copper/SiC composites have been produced by powder metallurgy. Silicon carbide is not stable in copper at the temperature needed for the fabrication of Cu/SiC. The major challenge in development of Cu/SiC is the suppression of this reaction between copper and SiC. Improvements in bonding strength and thermo-physical properties of the composites have been achieved by a vapour deposited molybdenum coating on SiC powders to control the detrimental interfacial reactions. (c) 2007 Elsevier Ltd. All rights reserved.

引用

页码：2398 / 2403

页数：6

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