Differential sensing strategy for dynamic thermal testing of ICs

被引：9

作者：

Altet, J

Rubio, A

机构：

来源：

15TH IEEE VLSI TEST SYMPOSIUM, PROCEEDINGS | 1997年

关键词：

thermal testing; thermal sensors;

D O I：

10.1109/VTEST.1997.600328

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

A new testing alternative based on thermal wave propagation is proposed. Some failures, when activated, produce an increase in local power dissipation at various points. A thermal wave is generated by this increase and can be used as a test observable. In this paper, both the thermal wave and the heat sources that appear for a set of faults are characterised and a built-in sensing strategy based on differential considerations is analysed.

引用

页码：434 / 439

页数：6