共 37 条
[1]
Cascaded Multicore Vapor Chambers for Intrapackage Spreading of High-Power, Heterogeneous Heat Loads
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,
2021, 11 (06)
:944-954
[5]
Effect of thermal aging on board level drop reliability for Pb-free BGA packages
[J].
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS,
2004,
:1256-1262
[6]
Damoulakis G, 2022, J ELECT PACKAG, V144, DOI [10.1115/1.4051467, DOI 10.1115/1.4051467]
[7]
AN OVERVIEW OF HIGH-TEMPERATURE ELECTRONIC DEVICE TECHNOLOGIES AND POTENTIAL APPLICATIONS
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A,
1994, 17 (04)
:594-609
[9]
Enhancing Dropwise Condensation through Bioinspired Wettability Patterning
[J].
LANGMUIR,
2014, 30 (43)
:13103-13115