Role of ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

被引：47

作者：

Song, JM ^{[1
]}

Liu, PC

Shih, CL

Lin, KL

机构：

[1] Natl Dong Hwa Univ, Dept Mat Sci & Engn, Hualien 974, Taiwan

[2] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2005年 / 34卷 / 09期

关键词：

lead-free solder; Sn-Zn; interfacial intermetallics;

D O I：

10.1007/s11664-005-0270-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, zeta-AgZn and gamma-Ag5Zn8 form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of epsilon-AgZn3 from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn3 is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.

引用

页码：1249 / 1254

页数：6

共 22 条

[1] The thermal property of lead-free Sn-8.55Zn-1Ag-XAI solder alloys and their wetting interaction with Cu [J].

Cheng, SC ;

Lin, KL .

JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (09) :940-945

[2]

GLAZER J, 1995, INT MATER REV, V40, P65, DOI 10.1179/095066095790151115

[3] Interfacial reactions of tin-zinc-bismuth alloys [J].

Harris, P .

SOLDERING & SURFACE MOUNT TECHNOLOGY, 1999, 11 (03) :46-52

[4] Wetting properties of and interfacial reactions in lead-free Sn-Zn based solders on Cu and Cu plated with an electroless Ni-P/Au layer [J].

Huang, CW ;

Lin, KL .

MATERIALS TRANSACTIONS, 2004, 45 (02) :588-594

[5] Interfaces in lead-free soldering [J].

Hwang, CW ;

Kim, KS ;

Suganuma, K .

JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (11) :1249-1256

[6]

*ICDD, 710397 ICDD

[7]

*ICDD, 251325 ICDD

[8]

*ICDD, 260956 ICDD

[9] Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu [J].

Kim, KS ;

Huh, SH ;

Suganuma, K .

MICROELECTRONICS RELIABILITY, 2003, 43 (02) :259-267

[10] Wetting interaction between Sn-Zn-Ag solders and Cu [J].

Lin, KL ;

Shih, CL .

JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (02) :95-100

← 1 2 3 →