Role of ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

被引：46

作者：

Song, JM ^{[1
]}

Liu, PC

Shih, CL

Lin, KL

机构：

[1] Natl Dong Hwa Univ, Dept Mat Sci & Engn, Hualien 974, Taiwan

[2] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2005年 / 34卷 / 09期

关键词：

lead-free solder; Sn-Zn; interfacial intermetallics;

D O I：

10.1007/s11664-005-0270-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, zeta-AgZn and gamma-Ag5Zn8 form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of epsilon-AgZn3 from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn3 is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.

引用

页码：1249 / 1254

页数：6

共 22 条

[1] The thermal property of lead-free Sn-8.55Zn-1Ag-XAI solder alloys and their wetting interaction with Cu
Cheng, SC
Lin, KL
[J]. JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (09) : 940 - 945
[2] GLAZER J, 1995, INT MATER REV, V40, P65, DOI 10.1179/095066095790151115
[3] Interfacial reactions of tin-zinc-bismuth alloys
Harris, P
[J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 1999, 11 (03) : 46 - 52
[4] Wetting properties of and interfacial reactions in lead-free Sn-Zn based solders on Cu and Cu plated with an electroless Ni-P/Au layer
Huang, CW
Lin, KL
[J]. MATERIALS TRANSACTIONS, 2004, 45 (02) : 588 - 594
[5] Interfaces in lead-free soldering
Hwang, CW
Kim, KS
Suganuma, K
[J]. JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (11) : 1249 - 1256
[6] *ICDD, 710397 ICDD
[7] *ICDD, 251325 ICDD
[8] *ICDD, 260956 ICDD
[9] Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu
Kim, KS
Huh, SH
Suganuma, K
[J]. MICROELECTRONICS RELIABILITY, 2003, 43 (02) : 259 - 267
[10] Wetting interaction between Sn-Zn-Ag solders and Cu
Lin, KL
Shih, CL
[J]. JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (02) : 95 - 100

← 1 2 3 →