Embedded Components for High Temperature Automotive Applications

被引:3
|
作者
Gruebl, Wolfgang [1 ]
Gross, Stephanie [1 ]
Schuch, Bernhard [1 ]
机构
[1] Continental AG, Adv Elect & Mat, Nurnberg, Germany
来源
2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018) | 2018年
关键词
automotive; embedded passives; power embedding; PCB technology; miniaturization; automotive requirement;
D O I
10.1109/ECTC.2018.00190
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The Automotive industry today and in the near future is undergoing fundamental changes due to the megatrends like autonomous driving and the challenging field of lowering CO2 emissions by optimization of combustion systems, electrification of the powertrain and improvement of the drivetrain efficiency. Those trends force additional functionalities, higher system integration levels and significant improvements in certain properties of the electronics, like electrical switching behavior or optimized power dissipation management in a highly miniaturized and robust control unit. A technology with huge potential to solve those tasks is the component embedding technology into the Printed Circuit Board (PCB). Continental is one of the major automotive drivers of this technology both for embedded passive and for embedded actives components and provides information on recent funding projects as well as own reliability assessments of different embedded component types.
引用
收藏
页码:1233 / 1237
页数:5
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