TRANSFORMATION OF 2D PLANES INTO 3D SOFT STRUCTURES WITH ELECTRICAL FUNCTIONS

被引:0
|
作者
Moon, Hyunmin [1 ]
Park, Byungwook [1 ]
Kim, Sohee [1 ]
机构
[1] Daegu Gyeongbuk Inst Sci & Technol DGIST, Daegu, South Korea
来源
2021 21ST INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS) | 2021年
基金
新加坡国家研究基金会;
关键词
bio-integrated electronics; soft electronics; flexible electronics; 3D structures; crack-free electrodes;
D O I
10.1109/TRANSDUCERS50396.2021.9495560
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
3-dimensional (3D) structures composed of flexible and soft materials have been in demand for bio-integrated devices. However, the fabrication of 3D structures using micro electro mechanical systems (MEMS) techniques has limitations in terms of commonly used inorganic materials and the microscale of resulted structures. Here, we developed a novel technique to selectively bond polydimethylsiloxane (PDMS) and parylene C by plasma treatment, with which 2D structures fabricated using conventional MEMS techniques are transformed into 3D structures by the inflation of selectively non-bonded patterns. We demonstrated various soft and flexible 3D devices with embedded electrical functions for biomedical applications.
引用
收藏
页码:1 / 3
页数:3
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