Micron-scale pattern formation in prestressed polygonal films

被引:5
|
作者
Annabattula, R. K. [1 ]
Onck, P. R. [1 ]
机构
[1] Univ Groningen, Zernike Inst Adv Mat, NL-9747 AG Groningen, Netherlands
关键词
THIN-FILMS; DELAMINATION; FABRICATION; NETWORKS;
D O I
10.1063/1.3544467
中图分类号
O59 [应用物理学];
学科分类号
摘要
In this paper we explore the spontaneous formation of micropatterns in thin prestressed polygonal films using finite element simulations. We study films with different size, thickness, and shape, including square, rectangular, pentagonal, and hexagonal films. Patterns form when the films release the internal eigenstrain by buckling-up, after which the films bond-back to the substrate. After an initial symmetric evolution of the buckling profile, the symmetry of the deflection pattern breaks when the wavelength of wriggles near the film edges decreases. During bond back the deflection morphology converges to a fourfold, fivefold, and sixfold ridging pattern for the square, pentagonal and hexagonal films, respectively, showing a close resemblance with experimental film systems of similar size and shape. Rectangular films of large length to width ratio go through a transition in buckling shapes from the initial Euler mode, through the varicose mode into the antisymmetric telephone-cord mode. For all the film shapes, the ratio of the film height to the effective film width scales with the square root of eigenstrain and is independent of thickness. The bond-back mechanism determines the final wrinkle morphology and is governed by the eigenstrain value at the end of the buckling-up stage and the dimensionless parameter (Gamma/EWeq)(W-eq/t)(3), relating the interface energy to the strain energy in the film. (C) 2011 American Institute of Physics. [doi:10.1063/1.3544467]
引用
收藏
页数:10
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