Study of Process Variations on ft in 30 nm Gate Length FinFET Using TCAD Simulations

被引:0
作者
Lakshmi, B. [1 ]
Srinivasan, R. [1 ]
机构
[1] SSN Coll Engn, Dept Informat Technol, Madras, Tamil Nadu, India
来源
COMPUTER NETWORKS AND INFORMATION TECHNOLOGIES | 2011年 / 142卷
关键词
f(t); FinFET; sensitivity; process variations; TCAD;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This paper investigates the effect of process variations on unity gain frequency (f(t)) in 30 nm gate length FinFET by performing extensive 3D TCAD simulations. TCAD tools are used to study device sensitivities on process variations. Sensitivity of f(t) on five different process parameters is studied. It is found that f(t) is more sensitive to gate length, underlap and corner radius, and less sensitive to hardmask height. Sensitivity of f(t) to fin width depends upon channel doping levels.
引用
收藏
页码:482 / 486
页数:5
相关论文
共 9 条
  • [1] Curatola G., 2007, IEEE T ELECT DEVICES, V54
  • [2] DAMBRINE G, 2003, IEEE ELECT DEVICE LE, V24
  • [3] Kim H.-S., 2009, IEEE ELECT DEVICE LE, V30
  • [4] Kim K.Y., 15 KOR C SEM FEBR 20
  • [5] Morteza F., 2007, SETIT 2007 4 INT C S
  • [6] Nuttinck S., 2007, IEEE T ELECT DEVICES, V54
  • [7] Quantum Transport Based Simulation and Design Optimization of a 10 nm FinFET
    Sabry, Yasser M.
    Abdolkader, Tarek M.
    Farouk, Wael Fikry
    [J]. DTIS: 2009 4TH IEEE INTERNATIONAL CONFERENCE ON DESIGN & TECHNOLOGY OF INTEGRATED SYSTEMS IN NANOSCALE ERA, PROCEEDINGS, 2009, : 125 - +
  • [8] The end of CMOS scaling
    Skotnicki, T
    Hutchby, JA
    King, TJ
    Wong, HSP
    Boeuf, F
    [J]. IEEE CIRCUITS & DEVICES, 2005, 21 (01): : 16 - 26
  • [9] Wang R., 2007, IEEE T ELECT DEVICES, V54