Optical fiber sensors embedded in polymer flexible

被引:8
作者
Van Hoe, Bram [1 ]
Van Steenberge, Geert [1 ]
Bosman, Erwin
Missinne, Jeroen [1 ]
Geernaert, Thomas
Berghmans, Francis
Webb, David
Van Daele, Peter
机构
[1] Ghent Univ Imec, Elis Dept, Ctr Microsyst Technol CMST, Ghent, Belgium
来源
OPTICAL SENSING AND DETECTION | 2010年 / 7726卷
关键词
embedding; fiber Bragg grating; molding; optical fiber sensor; photonic skin; polymer; polymer optical fiber; BRAGG GRATINGS;
D O I
10.1117/12.854865
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In traditional electrical sensing applications, multiplexing and interconnecting the different sensing elements is a major challenge. Recently, many optical alternatives have been investigated including optical fiber sensors of which the sensing elements consist of fiber Bragg gratings. Different sensing points can be integrated in one optical fiber solving the interconnection problem and avoiding any electromagnetical interference (EMI). Many new sensing applications also require flexible or stretchable sensing foils which can be attached to or wrapped around irregularly shaped objects such as robot fingers and car bumpers or which can even be applied in biomedical applications where a sensor is fixed on a human body. The use of these optical sensors however always implies the use of a light-source, detectors and electronic circuitry to be coupled and integrated with these sensors. The coupling of these fibers with these light sources and detectors is a critical packaging problem and as it is well-known the costs for packaging, especially with optoelectronic components and fiber alignment issues are huge. The end goal of this embedded sensor is to create a flexible optical sensor integrated with (opto) electronic modules and control circuitry. To obtain this flexibility, one can embed the optical sensors and the driving optoelectronics in a stretchable polymer host material. In this article different embedding techniques for optical fiber sensors are described and characterized. Initial tests based on standard manufacturing processes such as molding and laser structuring are reported as well as a more advanced embedding technique based on soft lithography processing.
引用
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页数:10
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