Imaging of thermal properties and topography by combined scanning thermal and scanning tunneling microscopy

被引：3
|
作者：
Oesterschulze, E
Stopka, M
机构：
[1] Institute of Technical Physics, University of Kassel, 34109 Kassel
来源：
MICROELECTRONIC ENGINEERING | 1996年 / 31卷 / 1-4期
关键词：
D O I：
10.1016/0167-9317(95)00347-9
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
[No abstract available]
引用
收藏
页码：241 / 248
页数：8
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