Three-dimensional CMOL: three-dimensional integration of CMOS/nanomaterial hybrid digital circuits

被引：31
|
作者：
Tu, D. [1 ]
Liu, M. [1 ]
Wang, W. [2 ]
Haruehanroengra, S. [2 ]
机构：
[1] Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
[2] Indiana Univ Purdue Univ, ECE Dept, Indianapolis, IN 46202 USA
来源：
MICRO & NANO LETTERS | 2007年 / 2卷 / 02期
基金：
美国国家卫生研究院;
关键词：
D O I：
10.1049/mnl:20070034
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The CMOS molecular (CMOL) circuit is a promising hybrid structure incorporating the nanowire crossbar into the CMOS integrated circuit (IC) implementation. In this letter, a novel three-dimensional (3D) architecture of the CMOL circuit is introduced. This structure eliminates the special pin requirement of the original CMOL designs, providing a feasible and efficient solution to build the practical CMOL circuits. In this 3D structure, the density of the nanowire crossbar is doubled. Such a high-density implementation enables the 3D CMOL technology to leap ahead of the IC roadmap by more than three generations.
引用
收藏
页码：40 / 45
页数：6
相关论文
共 50 条
  • [1] Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems
    Lee, Kang-Wook
    Noriki, Akihiro
    Kiyoyama, Kouji
    Fukushima, Takafumi
    Tanaka, Tetsu
    Koyanagi, Mitsumasa
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2011, 58 (03) : 748 - 757
  • [2] Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
    Lau, John H.
    JOURNAL OF ELECTRONIC PACKAGING, 2014, 136 (04)
  • [3] Three-Dimensional Integrated Circuits
    Henkel, Joerg
    IEEE DESIGN & TEST, 2016, 33 (02) : 4 - 6
  • [4] Three-dimensional integrated circuits
    Topol, Anna W.
    La Tulipe Jr., Douglas C.
    Shi, Leathen
    Frank, David J.
    Bernstein, Kerry
    Steen, Steven E.
    Kumar, Arvind
    Singco, Gilbert U.
    Young, Albert M.
    Guarini, Kathryn W.
    Ieong, Meikei
    IBM Journal of Research and Development, 2006, 50 (4-5): : 491 - 506
  • [5] Three-dimensional integrated circuits
    Topol, A. W.
    La Tulipe, D. C., Jr.
    Shi, L.
    Frank, D. J.
    Bernstein, K.
    Steen, S. E.
    Kumar, A.
    Singco, G. U.
    Young, A. M.
    Guarini, K. W.
    Ieong, M.
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2006, 50 (4-5) : 491 - 506
  • [6] Integration of Computed Tomography and Three-Dimensional Echocardiography for Hybrid Three-Dimensional Printing in Congenital Heart Disease
    Jordan Gosnell
    Todd Pietila
    Bennett P. Samuel
    Harikrishnan K. N. Kurup
    Marcus P. Haw
    Joseph J. Vettukattil
    Journal of Digital Imaging, 2016, 29 : 665 - 669
  • [7] Integration of Computed Tomography and Three-Dimensional Echocardiography for Hybrid Three-Dimensional Printing in Congenital Heart Disease
    Gosnell, Jordan
    Pietila, Todd
    Samuel, Bennett P.
    Kurup, Harikrishnan K. N.
    Haw, Marcus P.
    Vettukattil, Joseph J.
    JOURNAL OF DIGITAL IMAGING, 2016, 29 (06) : 665 - 669
  • [8] Three-dimensional stress analysis by three-dimensional local hybrid method
    Machida, K
    FRACTURE AND STRENGTH OF SOLIDS VI, PTS 1 AND 2, 2006, 306-308 : 523 - 528
  • [9] Three-dimensional Stress Analysis by a Digital Image Correlation Method and the Three-dimensional Local Hybrid Method
    Kojima, Hiroyuki
    Machida, Kenji
    Zhang, Zu Guang
    FRACTURE AND STRENGTH OF SOLIDS VII, PTS 1 AND 2, 2011, 462-463 : 106 - +
  • [10] Three-dimensional silicon integration
    Knickerbocker, J. U.
    Andry, P. S.
    Dang, B.
    Horton, R. R.
    Interrante, M. J.
    Patel, C. S.
    Polastre, R. J.
    Sakuma, K.
    Sirdeshmukh, R.
    Sprogis, E. J.
    Sri-Jayantha, S. M.
    Stephens, A. M.
    Topol, A. W.
    Tsang, C. K.
    Webb, B. C.
    Wright, S. L.
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2008, 52 (06) : 553 - 569
12345