Finite Element Simulation of Laser Shock Processing SiCp/Cu Matrix Composites

被引:0
作者
Zhang Jie [1 ]
Sun Aihua [1 ]
Zhu Le [1 ]
Gu Xiang [1 ]
Ge Xiaolan [1 ]
机构
[1] Jiangsu Univ, Sch Mech Engn, Adv Forming Technol Inst, Zhenjiang 212013, Peoples R China
关键词
laser shock processing; SiCp/Cu matrix composites; finite element simulate; residual stress; ALUMINUM;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In order to study the effect of laser shock processing on the mechanical properties of SiCp/Cu composites, a finite element software ANSYS/LS-DYNA was used to simulate the laser peening of unit cell model for the composites. Results show that there is extensive compressive stress in the matrix which results in the yield hardening of the matrix during loading process, and therefore the matrix strength is improved greatly. There is also equivalent stress in the interface between the matrix and particle reinforcement. The tensile properties of the samples before and after laser shock processing were compared by a WDW-200 universal tensile testing machine. It is indicated that the tensile strength of the shock sample is increased by 18 MPa after laser shock processing, whose fracture presents dimple morphology microvoid-congregated fracture., Results show that the laser shocking processing can improve the mechanical properties of SiCp/Cu composites.
引用
收藏
页码:444 / 447
页数:4
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