The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing

被引：14

作者：

Kuo, Shih-Ming ^{[1
]}

Lin, Kwang-Lung ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2007年 / 36卷 / 10期

关键词：

electromigration; hillock;

D O I：

10.1007/s11664-007-0209-2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The electromigration (EM) that occurs in a Cu/Sn-9Zn/Cu lamella was investigated for hillock formation at room temperature with a current density of 10(3) A/cm(2) for up to 230 h. Hillocks and cavities grew in the middle of the bulk solder and at the cathode, respectively. The formation of hillocks was ascribed to a compressive stress resulting from the diffusion of Sn atoms driven by electromigration and Cu-Zn compound formation.

引用

页码：1378 / 1382

页数：5

共 14 条

[1] Electromigration and critical product in eutectic SnPb solder lines at 100 °C [J].

Agarwal, R. ;

Ou, Shengquan E. ;

Tu, K. N. .

JOURNAL OF APPLIED PHYSICS, 2006, 100 (02)

[2] Morphology and adhesion strength of the Sn-9Zn-3.5Ag/Cu interface after aging [J].

Chang, TC ;

Wang, MC ;

Hon, MH .

JOURNAL OF CRYSTAL GROWTH, 2004, 263 (1-4) :223-231

[3] Crystal growth of the intermetallic compounds at the Sn-9Zn-xAg/Cu interface during isothermal aging [J].

Chang, TC ;

Wang, MC ;

Hon, MH .

JOURNAL OF CRYSTAL GROWTH, 2003, 252 (1-3) :401-412

[4] DIFFUSION OF SB124, CD109, SN113, AND ZN65 IN TIN [J].

HUANG, FH ;

HUNTINGT.HB .

PHYSICAL REVIEW B, 1974, 9 (04) :1479-1488

[5] Electromigration in eutectic SnPb solder lines [J].

Huynh, QT ;

Liu, CY ;

Chen, C ;

Tu, KN .

JOURNAL OF APPLIED PHYSICS, 2001, 89 (08) :4332-4335

[6] Investigations of interfacial reactions of Sn-Zn based and Sn-Ag-Cu lead-free solder alloys as replacement for Sn-Pb solder [J].

Islam, MN ;

Chan, YC ;

Rizvi, MJ ;

Jillek, W .

JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 400 (1-2) :136-144

[7] Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder [J].

Islam, RA ;

Wu, BY ;

Alam, MO ;

Chan, YC ;

Jillek, W .

JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 392 (1-2) :149-158

[8] Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation [J].

Lee, BJ ;

Hwang, NM ;

Lee, HM .

ACTA MATERIALIA, 1997, 45 (05) :1867-1874

[9] Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes [J].

Liu, CY ;

Chen, C ;

Liao, CN ;

Tu, KN .

APPLIED PHYSICS LETTERS, 1999, 75 (01) :58-60

[10] Electromigration in Sn-Pb solder strips as a function of alloy composition [J].

Liu, CY ;

Chen, C ;

Tu, KN .

JOURNAL OF APPLIED PHYSICS, 2000, 88 (10) :5703-5709

← 1 2 →