micromachining;
microstrip circuits;
power combiners;
power dividers;
waveguide;
waveguide transitions;
D O I:
10.1109/LMWC.2005.844214
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
The successful demonstration of a 1:4 power divider using microstrip probes and a WR-430 rectangular waveguide is presented. The 15-dB return loss bandwidth of the nonoptimized structure is demonstrated to be 22% and its 0.5-dB insertion loss bandwidth 26%. While realized through conventional machining, such a structure is assembled in a fashion consistent with proven millimeter and submillimeter-wave micromachining techniques. Thus, the structure presents a potential power dividing and power combining architecture, which through micromachining, may be used for applications well above 100 GHz.