Influence of temperature on tensile and fatigue behavior of nanoscale copper using molecular dynamics simulation

被引：93
作者：
Chang, WJ
Fang, TH
机构：
[1] Kun Shan Univ Technol, Dept Mech Engn, Tainan 71016, Taiwan
[2] So Taiwan Univ Technol, Dept Mech Engn, Tainan, Taiwan
来源：
JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS | 2003年 / 64卷 / 08期
关键词：
metals; nanostructures; mechanical properties;
D O I：
10.1016/S0022-3697(03)00130-6
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
The tensile and fatigue behavior of nanoscale copper at various temperatures has been analyzed using molecular dynamics simulation. The stress-strain curve for nanoscale copper was obtained first and then the Young's modulus of the material was determined. The modulus was larger than that obtained by previous studies and decreased with increasing temperature. From the fatigue test, the cyclic stress-number of cycles curve was obtained and the stress increased with increasing temperature. Furthermore, the ductile fracture configuration was observed in the fatigue testing process under the lower applied stress. It was also observed that nanoscale copper appears to have a fatigue limit of 10(5) cycles. (C) 2003 Published by Elsevier Science Ltd.
引用
收藏
页码：1279 / 1283
页数：5
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