Mechanisms of grain boundary diffusion in intermetallic compounds

被引:1
|
作者
Divinski, SV [1 ]
Larikov, LN [1 ]
机构
[1] Ukrainian Acad Sci, Inst Met Phys, UA-252680 Kiev, Ukraine
来源
关键词
grain boundary diffusion; intermetallic compounds; topological order; vacancy; anti-structure defect;
D O I
10.4028/www.scientific.net/DDF.156.243
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Atomic topological and chemical orders appearing at contact of two grains of an intermetallic compound are analyzed within the presentations of high-dimensional crystallography. It was shown that the anti-structure-like defects are possible to introduce for grain boundary material. The grain boundary diffusivity of intermetallic compounds is suggested to be governed by such defects. AB(3) intermetallic compounds with L1(2) structure and AB intermetallics with B2 structure are treated. Probable application of the model under consideration to grain boundary self-diffusion in Ni(3)Al is examined.
引用
收藏
页码:243 / 248
页数:6
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