Foundry technology trend

被引：0
|
作者：
Sun, JYC [1 ]
机构：
[1] Taiwan Semicond Mfg Co, Sci Based Ind Pk, Hsinchu, Taiwan
来源：
PROCESS, EQUIPMENT, AND MATERIALS CONTROL IN INTEGRATED CIRCUIT MANUFACTURING IV | 1998年 / 3507卷
关键词：
foundry; CMOS; logic; embedded memory; ULSI; low power; interconnect; scaling; horizontal specialization; disintegration; system on chip;
D O I：
10.1117/12.324346
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This paper gives an overview of the foundry model and foundry technology trend in the future. The foundry model is a part of the natural trend toward the vertical dis-integration (or horizontal specialization) of the semiconductor industry. Foundry technology is already in the leading pack, and will be on the leading edge from now on. Foundry technology will be market driven toward low voltage (core), low power, high performance high density, and system on chip (SOC). Examples of leading-edge 0.25um logic and 0.18um and beyond process features will be used to illustrate this trend.
引用
收藏
页码：19 / 24
页数：6
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