CMOS-MEMS TRI-AXIAL PIEZO-RESISTIVE TACTILE SENSOR WITH MONOLITHICALLY/ VERTICALLY INTEGRATED INDUCTIVE PROXIMITY SENSOR

被引:0
作者
Lee, Jia-Horng [1 ]
Yeh, Sheng-Kai [1 ]
Fang, Weileun [1 ,2 ]
机构
[1] Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu, Taiwan
[2] Natl Tsing Hua Univ, Inst NanoEngn & MicroSyst, Hsinchu, Taiwan
来源
2019 20TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS & EUROSENSORS XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) | 2019年
关键词
Vertical integration; Tri-axial tactile sensor; piezo-resistive sensing technology; proximity sensor; inductive sensing technology; CMOS-MEMS; polymer;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This study demonstrates a novel tri-axial piezo-resistive tactile sensor vertically integrated with a inductive proximity sensor using standard CMOS process (Fig.1). Normal and shear loads sensing capabilities are achieved by measuring the signal changes of four piezo-resistive cross beams. The proposed sensor design has three merits: (1) the tri-axial tactile sensing unit and the proximity sensing unit can be vertically integrated on one chip, (2) normal and shear loads can be detected by four discrete piezo-resistive sensing elements, (3) the footprint of the chip can be reduced due to the vertical integration of sensing elements. The measurements demonstrate the capabilities of tactile sensing for both normal and shear loads and proximity sensing. The testing results indicate that the proposed tri-axial piezo-resistive tactile sensor shows the normal load (Z-axis) sensitivity of 0.55 mV/N, the X-axis shear load sensitivity of 1.3 mV/N, and the Y-axis shear load sensitivity of 0.76 mV/N.
引用
收藏
页码:1835 / 1838
页数:4
相关论文
共 13 条
  • [1] Araki R, 2017, 2017 19TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS), P1140
  • [2] Chen SC, 2017, 2017 19TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS), P1453
  • [3] Development of 3D carbon nanotube interdigitated finger electrodes on polymer substrate for flexible capacitive sensor application
    Hu, Chih-Fan
    Wang, Jhih-Yu
    Liu, Yu-Chia
    Tsai, Ming-Han
    Fang, Weileun
    [J]. NANOTECHNOLOGY, 2013, 24 (44)
  • [4] Normal and shear force measurement using a flexible polymer tactile sensor with embedded multiple capacitors
    Lee, Hyung-Kew
    Chung, Jaehoon
    Chang, Sun-Il
    Yoon, Euisik
    [J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2008, 17 (04) : 934 - 942
  • [5] Dual-Mode Capacitive Proximity Sensor for Robot Application: Implementation of Tactile and Proximity Sensing Capability on a Single Polymer Platform Using Shared Electrodes
    Lee, Hyung-Kew
    Chang, Sun-Il
    Yoon, Euisik
    [J]. IEEE SENSORS JOURNAL, 2009, 9 (12) : 1748 - 1755
  • [6] CMOS-MEMS piezoresistive force sensor with scanning signal process circuit for vertical probe card
    Lee, Kuo-Yu
    Huang, Jung-Tang
    Hsu, Hou-Jun
    Chiu, Ming-Chieh
    Tsai, Ting-Chiang
    Chen, Ching-Kong
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 2010, 160 (1-2) : 22 - 28
  • [7] Development of a CMOS-Based Capacitive Tactile Sensor With Adjustable Sensing Range and Sensitivity Using Polymer Fill-In
    Liu, Yu-Chia
    Sun, Chih-Ming
    Lin, Li-Yuan
    Tsai, Ming-Han
    Fang, Weileun
    [J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2011, 20 (01) : 119 - 127
  • [8] Development of a proximity sensor with vertically monolithic integrated inductive and capacitive sensing units
    Lo, Pei-Hsuan
    Tseng, Shih-Hsiung
    Yeh, Jen-Hao
    Fang, Weileun
    [J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2013, 23 (03)
  • [9] Design of Battery Thermal Management Unit with PCM for Electrical Vehicle: Part I: Modelling and Analysis of Pouch Type Battery Cell
    Oh, Sangmin
    Lee, Junchan
    Lee, Hyeonjung
    Shin, Dongu
    Thalluri, Teressa
    Shin, Kyoojae
    [J]. PROCEEDINGS OF THE 2019 IEEE EURASIA CONFERENCE ON IOT, COMMUNICATION AND ENGINEERING (ECICE), 2019, : 82 - 85
  • [10] Monolithic integration of capacitive sensors using a double-side CMOS MEMS post process
    Sun, Chih-Ming
    Wang, Chuanwei
    Tsai, Ming-Han
    Hsieh, Hsieh-Shen
    Fang, Weileun
    [J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2009, 19 (01)