Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

被引:1
|
作者
Raghupathy, Arun Prakash [1 ]
Janssen, John
Aranyosi, Attila [1 ]
Ghia, Urmila [2 ]
Ghia, Karman [3 ]
Maltz, William [1 ]
机构
[1] Elect Cooling Solut Inc, Santa Clara, CA 95051 USA
[2] Univ Cincinnati, Dept Mech Engn, Computat Fluid Dynam Res Lab, Cincinnati, OH 45221 USA
[3] Univ Cincinnati, Dept Aerosp Engn, Computat Fluid Dynam Res Lab, Cincinnati, OH 45221 USA
关键词
DELPHI; multisource; DOTCOMP; compact thermal model; boundary-condition independent models; ELECTRONIC PARTS; SPECIAL SECTION;
D O I
10.1115/1.4003217
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done using the DEvelopment of Libraries of PHysical models for an Integrated design (DELPHI) methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction and typically has four fixed heat generating sources. The detailed model for the SFP is constructed and calibrated using a natural convection experiment. The calibrated detailed model is used for generating the limited boundary-condition-independent compact thermal model (CTM). Limited boundary-condition-independence, in this case, refers only to a small subset of all "thinkable" boundary conditions that are experienced by the SFP device in practical situations. The commercial optimization tool developed by the DELPHI team, DOTCOMP, is used for generating the compact thermal model. A detailed validation of the CTM of the SFP in real-time applications using FLOTHERM 7.2, a computational fluid dynamics-based thermal analysis software package, is performed. The results show excellent agreement between the results predicted by the SFP CTM with the data from the detailed model. The SFP CTM predicts the junction temperature of the four power-dissipating components and the heat flows through the sides with relative error less than 10%. [DOI: 10.1115/1.4003217]
引用
收藏
页数:10
相关论文
共 50 条
  • [41] Compact and High-Density Opto-electronic Transceiver Module for Chip-to-Chip Optical Interconnects
    Mori, Tetsuya
    Fujiwara, Makoto
    Terada, Shinsuke
    Choki, Koji
    2011 OPTICAL FIBER COMMUNICATION CONFERENCE AND EXPOSITION (OFC/NFOEC) AND THE NATIONAL FIBER OPTIC ENGINEERS CONFERENCE, 2011,
  • [42] Development of an opto-electronic positioning device for serial direct digital images of oral structures
    Morea, C
    Langlotz, F
    Scheer, C
    Bürgin, W
    Nolte, LP
    Lang, NP
    Brägger, U
    JOURNAL OF PERIODONTAL RESEARCH, 2000, 35 (04) : 225 - 231
  • [43] Development of CdMnTe thin films using electroplating technique for opto-electronic device applications
    O. I. Olusola
    M. L. Madugu
    A. A. Ojo
    I. M. Dharmadasa
    Journal of Materials Science: Materials in Electronics, 2020, 31 : 22151 - 22161
  • [44] Development of Optics with Micro-LED Arrays for Improved Opto-electronic Neural Stimulation
    Chaudet, Lionel
    Neil, Mark
    Degenaar, Patrick
    Mehran, Kamyar
    Berlinguer-Palmini, Rolando
    Corbet, Brain
    Maaskant, Pleun
    Rogerson, David
    Lanigan, Peter
    Bamberg, Ernst
    Roska, Botond
    OPTOGENETICS: OPTICAL METHODS FOR CELLULAR CONTROL, 2013, 8586
  • [45] Development of CdMnTe thin films using electroplating technique for opto-electronic device applications
    Olusola, O., I
    Madugu, M. L.
    Ojo, A. A.
    Dharmadasa, I. M.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (24) : 22151 - 22161
  • [46] Ab initio study of structural, opto-electronic, elastic, and thermal properties of KZnF3
    Erum, Nazia
    Iqbal, Muhammad Azhar
    CANADIAN JOURNAL OF PHYSICS, 2021, 99 (07) : 551 - 558
  • [47] Investigation of physical, spectral and thermal properties of a dimethoxy substituted chalcone for opto-electronic device applications
    Menezes, Anthoni Praveen
    Jayarama, A.
    Ravindra, H. J.
    MATERIALS TODAY-PROCEEDINGS, 2021, 35 : 374 - 377
  • [48] ELECTRONIC BOARD MODELING BY THE MEANS OF DELPHI COMPACT THERMAL MODEL OF COMPONENTS
    Monier-Vinard, Eric
    Bissuel, Valentin
    Dia, Cheikh Tidiane
    Daniel, Olivier
    Laraqi, Najib
    2014 20TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2014), 2014,
  • [49] Study on laser light-screen-type opto-electronic protective device for pressing machine
    Laser Inst, Acad of Sciences of, Shandong Province, Jining, China
    Guangxue Jishu, 3 (34-35, 39):
  • [50] Opto-electronic neuron-type operation via stimulated Raman scattering in optical fiber
    Tariq, S
    Habib, MK
    Helmy, HA
    JOURNAL OF LIGHTWAVE TECHNOLOGY, 1997, 15 (06) : 938 - 947