Packaging technology in MEMS

被引：0

作者：

Shi, YB ^{[1
]}

Liu, J ^{[1
]}

Zhang, WD ^{[1
]}

机构：

[1] N China Inst Technol, Dept Elect Engn, Minist Educ China, Key Lab Instrumentat Sci & Dynam Measurement, Shanxi Taiyuan 030051, Peoples R China

来源：

ISTM/2003: 5TH INTERNATIONAL SYMPOSIUM ON TEST AND MEASUREMENT, VOLS 1-6, CONFERENCE PROCEEDINGS | 2003年

关键词：

packaging; MEMS; flip chip;

D O I：

暂无

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

MEMS is a relatively new field which is tied so closely with silicon processing that most of the early packaging technologies will most likely use "off-the-shelf" packaging "borrowed" from the semiconductor microelectronics field. In this paper, the present packaging types are first introduced, and then elaborated the Chip Scale Package which is the cost-effective replacement fore the traditional hermetic package, finally, some commercial packages for MEMS devices is given.

引用

页码：175 / 178

页数：4

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