An analysis of mixed lubrication in chemical mechanical polishing

被引：10

作者：

Ng, SH ^{[1
]}

Higgs, CF

Yoon, I

Danyluk, S

机构：

[1] Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA

[2] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA

来源：

JOURNAL OF TRIBOLOGY-TRANSACTIONS OF THE ASME | 2005年 / 127卷 / 02期

关键词：

mixed lubrication; roughness; sub-ambient pressure; chemical mechanical polishing; flow factors; contact mechanics;

D O I：

10.1115/1.1760551

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

Pressure and shear flow factors (Patir and Cheng, 1978) were used to take into account the roughness of the pad surface in the modeling of the interfacial fluid pressure during chemical mechanical polishing. An attempt was made to explain the physical meaning of the flow factors in this particular application. Additionally, a parametric study was carried out to see the effect on the model after the incorporation of the flow factors. The pressure and shear flow factors were found to have a competing effect on the magnitude of the sub-ambient fluid pressure.

引用

页码：287 / 292

页数：6

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