Study of Si(100) surfaces etched in TMAH solution

被引:24
作者
Sakaino, K [1 ]
Adachi, S [1 ]
机构
[1] Gunma Univ, Fac Engn, Dept Elect Engn, Kiryu, Gumma 3768515, Japan
关键词
silicon; anisotropic etching; TMAH solution; spectroscopic ellipsometry; dielectric function; atomic force microscopy; surface roughness;
D O I
10.1016/S0924-4247(00)00501-X
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Si(1 0 0) surfaces treated in a tetramethylammonium hydroxide (TMAH) solution at 70 degreesC have been studied using spectroscopic ellipsometry (SE) and ex situ atomic force microscopy (AFM). The SE data indicate that surface native oxide is etched gradually and then lift-off in places with immersing in the solution. Since the solution attacks bulk silicon more rigorously than the surface native oxide, the Si(1 0 0) surface of partly remained SiO2 becomes very rough. The AFM image confirms a very roughened sample surface (rms roughness of similar to5.9 nm). Just after the surface native oxide is etched away completely, the SE data yield the spectrum of a nearly flat silicon surface. The AFM rms roughness for this sample is found to be similar to0.7.nm, in excellent agreement with an effective-medium approximation result (similar to0.6 nm). A correlation between roughness measured by AFM and SE results has also been discussed. (C) 2001 Elsevier Science B.V. All rights reserved.
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页码:71 / 78
页数:8
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