Application of high frequency scanning acoustic microscopy for the failure analysis and reliability assessment of MEMS sensors

被引：4

作者：

Oberhoff, S. ^{[1
]}

Goetz, K. ^{[1
]}

Trojan, K. ^{[1
]}

Zoeller, M. ^{[1
]}

Glueck, J. ^{[1
]}

机构：

[1] Robert Bosch GmbH, Automot Elect, Dieselstr 6, D-72770 Reutlingen, Germany

来源：

MICROELECTRONICS RELIABILITY | 2016年 / 64卷

关键词：

Scanning acoustic microscopy; High frequency SAM; Infrared microscopy; MEMS inertial sensors; Wafer bonding;

D O I：

10.1016/j.microrel.2016.07.108

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We successfully applied high frequency scanning acoustic microscopy (SAM) as a tool for the analysis of MEMS sensors. Using state of the art transducers with frequencies up to 300 MHz, we evaluated the achievable resolution and performed case studies: we localized a contamination-induced delamination on the ASIC surface and studied failure modes after mechanical stability tests, showing that a combination of SAM and infrared microscopical evaluation provides information about the course of cracks on a micrometer length scale. (C) 2016 Elsevier Ltd. All rights reserved.

引用

页码：656 / 659

页数：4

共 6 条

[1] Resolution of broadband transducers in acoustic microscopy of encapsulated ICs: Transducer selection
Canumalla, S
[J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 1999, 22 (04): : 582 - 592
[2] Wafer-Bonding for MEMS - Status and Trends
Hausner, R.
[J]. SEMICONDUCTOR WAFER BONDING 13: SCIENCE, TECHNOLOGY, AND APPLICATIONS, 2014, 64 (05): : 245 - 251
[3] IR confocal laser microscopy for MEMS technological evaluation
Lellouchi, D
Beaudoin, F
Le Touze, C
Perdu, P
Desplats, R
[J]. MICROELECTRONICS RELIABILITY, 2002, 42 (9-11) : 1815 - 1817
[4] Tittmann B. R., 2013, ADV ACOUSTIC MICROSC
[5] Applications of infrared microscopy to IC and MEMS packaging
Trigg, A
[J]. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2003, 26 (03): : 232 - 238
[6] Scanning acoustic GHz-microscopy versus conventional SAM for advanced assessment of ball bond and metal interfaces in microelectronic devices
Vogg, G.
Heidmann, T.
Brand, S.
[J]. MICROELECTRONICS RELIABILITY, 2015, 55 (9-10) : 1554 - 1558

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