Mixed-signal, packaging changes spell new choices for designers

被引：0
|
作者：
Murari, B [1 ]
机构：
[1] SGS THOMSON MICROELECT,AGRATE BRIANZA,ITALY
来源：
COMPUTER DESIGN | 1996年 / 35卷 / 12期
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：103 / &
页数：5
相关论文
共 50 条
  • [21] Mixed-signal design
    Comput Des, 3 (144):
  • [22] Mixed-signal design
    Ohr, Stephan
    Computer Design, 1992, 31 (06):
  • [23] MIXED-SIGNAL TESTING
    LOWE, L
    EE-EVALUATION ENGINEERING, 1994, 33 (07): : 12 - 12
  • [24] MIXED-SIGNAL DEVICES
    SCRIVENS, P
    EE-EVALUATION ENGINEERING, 1994, 33 (10): : 12 - 12
  • [25] MIXED-SIGNAL TECHNOLOGY
    DAN, G
    COMPUTER DESIGN, 1991, 30 (08): : 23 - 25
  • [26] MIXED-SIGNAL COUNTERPOINT
    WILLIAMSON, R
    EE-EVALUATION ENGINEERING, 1994, 33 (10): : 12 - 12
  • [27] Mixed-signal test
    Majhi, AK
    Agrawal, VD
    ELEVENTH INTERNATIONAL CONFERENCE ON VLSI DESIGN, PROCEEDINGS, 1997, : 285 - 288
  • [28] Radiative coupling in BGA packaging for mixed-signal and high-speed digital
    Woods, W
    Diaz-Alvarez, E
    Krusius, JP
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 511 - 517
  • [29] Effects of integrated circuit packaging on performance of a LNA in a mixed-signal circuit environment
    Unchwaniwala, KB
    Caggiano, MF
    2001 SOUTHWEST SYMPOSIUM ON MIXED-SIGNAL DESIGN, 2001, : 76 - 79
  • [30] New mixed-signal tools target systems on chips
    Lipman, Jim
    EDN, 1999, 44 (12):
12345