Ultra high I/O density package:: Sea of Leads (SoL)

被引：0

作者：

Bakir, MS ^{[1
]}

Patel, CS ^{[1
]}

Kohl, PA ^{[1
]}

Martin, KP ^{[1
]}

Meindl, JD ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

2001 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, PROCEEDINGS | 2001年 / 4428卷

关键词：

sea of leads (SoL); complaint wafer level package (CWLP); system-on-a-chip (SoC);

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Sea of Leads (SoL) is a novel ultra high input/output (I/O) density package (> 10(4) x-y-z compliant leads per cm(2)) that provides high bandwidth and high current distribution capacity for a system-on-a-chip (SoC). A prototype SoL with 12,000 leads per cm(2) has been designed and fabricated using our compliant wafer level packaging (CWLP) processing approach. The I/O density of the package is maximized by designing various lead lengths as a function of the necessary in-plane mechanical compliance, which increases linearly from the center. In addition, the leads are oriented along the die's local directions of expansion providing a higher degree of compliance. Two different lead lengths (53 mum leads on a 80 x 80 mum square lattice and 106 mum leads on a 80 x 160 mum rectangular lattice) totaling 12,000 leads per cm(2) are distributed across a 1 cm(2) die. SoL promises the capability of meeting high current (> 350 A) and high I/O bandwidth requirements as far ahead as the 35 nm generation node (year 2014) SoC. In essence, SoL extends wafer level batch processing of multilevel interconnects networks to include chip I/O leads.

引用

页码：335 / 339

页数：5