Thermal plasma technology: Where do we stand and where are we going?

被引：296

作者：

Pfender, E

机构：

[1] Univ Minnesota, Dept Mech Engn, Minneapolis, MN 55455 USA

[2] Univ Minnesota, ERC Plasma Aided Mfg, Minneapolis, MN 55455 USA

来源：

PLASMA CHEMISTRY AND PLASMA PROCESSING | 1999年 / 19卷 / 01期

基金：

美国国家科学基金会;

关键词：

thermal plasma technology assessment; research and development; overview;

D O I：

10.1023/A:1021899731587

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

In this overview, an attempt is made to assess the present and future research and development in thermal plasma processing of materials restricted to (1) thermal plasma coating technologies, (2) thermal plasma synthesis of fine powders, (3) thermal plasma waste destruction, and (4) thermal plasma spheroidization and densification. Since thermal plasma processing is, in general, governed by a large number of parameters, implementation of controls becomes mandatory. The lack of sufficient controls combined with economic drawbacks in some cases has been the main obstacle for the growth of thermal plasma technology. Present R&D efforts, however address these problems.

引用

页码：1 / 31

页数：31