A comparative analysis of innovative microchannel heat sinks for electronic cooling

被引:99
作者
Lu, Sainan [1 ]
Vafai, Kambiz [1 ]
机构
[1] Univ Calif Riverside, Dept Mech Engn, Riverside, CA 92521 USA
关键词
Double-layer microchannel; Multi-layer microchannel; Thermal resistance; Pumping power; DOUBLE-LAYER; NUMERICAL OPTIMIZATION; THERMAL PERFORMANCE; FLOW; NANOFLUID;
D O I
10.1016/j.icheatmasstransfer.2016.04.024
中图分类号
O414.1 [热力学];
学科分类号
摘要
In this work, a comparative analysis of innovative microchannel heat sinks such as two-layered and multi-layered microchannel heat sinks (MCHS), or thin films within flexible complex seals and cooling augmentation using microchannels with rotatable separating plates, is presented. A compilation of the numbers of layers, main characteristics, setups, advantages and disadvantages, thermal resistance, pumping power in double-layer (DL-MCHS) and multi-layer MCHS (ML-MCHS) is presented. In addition, the thermal resistance is analyzed in order to present a comparison between the single-layer MCHS (SL-MCHS) and multi-layer microchannels. The results of comparison indicates that double-layer and multi-layer MCHS have lower thermal resistance and require smaller pumping power and they resolve the high streamwise temperature rise problem of SL-MCHS. (C) 2016 Elsevier Ltd. All rights reserved.
引用
收藏
页码:271 / 284
页数:14
相关论文
共 56 条
[1]   Experimental microchannel heat sink performance studies using nanofluids [J].
Chein, Reiyu ;
Chuang, Jason .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2007, 46 (01) :57-66
[2]   Numerical study of the inlet/outlet arrangement effect on microchannel heat sink performance [J].
Chein, Reiyu ;
Chen, Janghwa .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2009, 48 (08) :1627-1638
[3]   Numerical simulation of stacked microchannel heat sink with mixing-enhanced passive structure [J].
Cheng, Y. J. .
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2007, 34 (03) :295-303
[4]   Optimisation of single and double layer counter flow microchannel heat sinks [J].
Chong, SH ;
Ooi, KT ;
Wong, TN .
APPLIED THERMAL ENGINEERING, 2002, 22 (14) :1569-1585
[5]   Manifold microchannel heat sinks: Isothermal analysis [J].
Copeland, D ;
Behnia, M ;
Nakayama, W .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1997, 20 (02) :96-102
[6]   Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging [J].
Dixit, Pradeep ;
Lin, Nay ;
Miao, Jianmin ;
Wong, Wai Kwan ;
Choon, Teo Kiat .
SENSORS AND ACTUATORS A-PHYSICAL, 2008, 141 (02) :685-694
[7]   Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips [J].
Escher, W. ;
Brunschwiler, T. ;
Michel, B. ;
Poulikakos, D. .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2010, 132 (08) :1-10
[8]   Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging [J].
Fedorov, AG ;
Viskanta, R .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2000, 43 (03) :399-415
[9]   Developing convective heat transfer in deep rectangular microchannels [J].
Harms, TM ;
Kazmierczak, MJ ;
Gerner, FM .
INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW, 1999, 20 (02) :149-157
[10]   Enhancement of thermal performance in double-layered microchannel heat sink with nanofluids [J].
Hung, Tu-Chieh ;
Yan, Wei-Mon .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2012, 55 (11-12) :3225-3238