共 31 条
[13]
Electroless and electrolytic copper plating of glass interposer combined with metal oxide adhesion layer for manufacturing 3D RF devices
[J].
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC),
2016,
:62-67
[14]
Direct laser writing of electromagnetic metasurfaces for infra-red frequency range
[J].
ADVANCED FABRICATION TECHNOLOGIES FOR MICRO/NANO OPTICS AND PHOTONICS XI,
2018, 10544
[19]
MEASUREMENT OF SHEET RESISTIVITIES WITH THE 4-POINT PROBE
[J].
BELL SYSTEM TECHNICAL JOURNAL,
1958, 37 (03)
:711-718