Multiscale simulation of nanometric cutting of single crystal copper-effect of different cutting speeds

被引:8
作者
Pen, Hongmin [1 ]
Bai, Qingshun [1 ]
Mang, Yingchun [1 ]
Chen, Mingjun [1 ]
机构
[1] Harbin Inst Technol, Sch Mechatron Engn, Harbin 150001, Peoples R China
基金
中国国家自然科学基金;
关键词
Multiscale simulation; Nanometric cutting; Single crystal copper; Propagation speed of plastic wave;
D O I
10.1016/S1006-7191(08)60121-0
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
A multiscale simulation has been performed to determine the effect of the cutting speed on the deformation mechanism and cutting forces in nanometric cutting of single crystal copper. The multiscale simulation model, which links the finite element method and the molecular dynamics method, captures the atomistic mechanisms during nanometric cutting from the free surface without the computational cost of full atomistic simulations. Simulation results show the material deformation mechanism of single crystal copper greatly changes when the cutting speed exceeds the material static propagation speed of plastic wave. At such a high cutting speed, the average magnitudes of tangential and normal forces increase rapidly. In addition, the variation of strain energy of work material atoms in different cutting speeds is investigated.
引用
收藏
页码:440 / 446
页数:7
相关论文
共 13 条
[1]  
[Anonymous], ANN CIRP
[2]   EMBEDDED-ATOM METHOD - DERIVATION AND APPLICATION TO IMPURITIES, SURFACES, AND OTHER DEFECTS IN METALS [J].
DAW, MS ;
BASKES, MI .
PHYSICAL REVIEW B, 1984, 29 (12) :6443-6453
[3]   Three-dimensional molecular dynamics analysis of processing using a pin tool on the atomic scale [J].
Fang, TH ;
Weng, CI .
NANOTECHNOLOGY, 2000, 11 (03) :148-153
[4]   Dislocation nucleation and defect structure during surface indentation [J].
Kelchner, CL ;
Plimpton, SJ ;
Hamilton, JC .
PHYSICAL REVIEW B, 1998, 58 (17) :11085-11088
[5]  
Liang YC, 2008, ACTA METALL SIN, V44, P937
[6]   The influence of different cutting speeds on the cutting force and strain-stress behaviors of single crystal copper during nano-scale orthogonal cutting [J].
Lin, Zone-Ching ;
Huang, Jen-Ching .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2008, 201 (1-3) :477-482
[7]   Large scale molecular dynamics study of nanometric machining of copper [J].
Pei, Q. X. ;
Lu, C. ;
Lee, H. P. .
COMPUTATIONAL MATERIALS SCIENCE, 2007, 41 (02) :177-185
[8]   Intermixing of a system with positive heat of mixing at high strain rates [J].
Sheng, HW ;
Ma, E .
PHYSICAL REVIEW B, 2001, 63 (22)
[9]   Multiscale simulation of material removal processes at the nanoscale [J].
Shiari, Behrouz ;
Miller, Ronald E. ;
Klug, Dennis D. .
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2007, 55 (11) :2384-2405
[10]  
SHIMADA S, 1994, CIRP ANN-MANUF TECHN, V43, P51