Compactly Packaged High-Speed Optical Transceiver Using Silicon Photonics ICs on Ceramic Submount

被引：3

作者：

Kim, Do-Won ^{[1
]}

Jin, Andy Lim Eu ^{[1
]}

Raja, M. Kumarasamy ^{[1
]}

Kulkami, Vishal Vinayak ^{[1
]}

Wai, Leong Ching ^{[1
]}

Yang, Jason Liow Tsung ^{[1
]}

Qiang, Patrick Lo Guo ^{[1
]}

机构：

[1] ASTAR, Inst Microelect IME, Nano Photon Program, Singapore, Singapore

来源：

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2016年

关键词：

optical transceiver; silicon photoncis; ceramic submount; compact packaging; flip-chip bonding; stud bumping;

D O I：

10.1109/ECTC.2016.88

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

High-speed optical module is demonstrated using silicon photonics integrated circuits (Si-PIC) by compact packaging on ceramic submount of which size is 4 mm x 21 mm x 1.1 mm. The electronic integrated circuits (EIC) such as transimpedance amplifier (TIA) for photodetector and driver IC for modulator are flip-chip bonded on the submount using 1 mil diameter of Au stud bumps. The optical transceiver is packaged through the flip-chip bonding of the packaged submount by SAC solders on the evaluation PCB on which RF signal transmission lines are precisely designed. The reliable flip-chip bonding state of the EICs and submount are verified through shear test and x-ray image. Eye diagram is demonstrated at 20 Gbps for receiver module.

引用

页码：1075 / 1080

页数：6

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