A 4 mm2 Double Differential Torsional MEMS Accelerometer Based on a Double-Beam Configuration

被引:6
作者
Miao, Tongqiao [1 ]
Xiao, Dingbang [1 ]
Li, Qingsong [1 ]
Hou, Zhanqiang [1 ]
Wu, Xuezhong [1 ]
机构
[1] Natl Univ DefenseTechnol, Coll Mech Engn & Automat, Changsha 410073, Hunan, Peoples R China
基金
中国国家自然科学基金;
关键词
double differential; torsional; MEMS; accelerometer; double-beam; temperature robustness; CAPACITIVE ACCELEROMETER; SENSITIVITY;
D O I
10.3390/s17102264
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
This paper reports the design and simulation of a 4 mm(2) double differential torsional MEMS accelerometer based on a double-beam configuration. Based on the structure of conventional torsional accelerometers, normally composed of one pair of proof masses and one torsional beam, this work explores the double differential configuration: a torsional accelerometer with two pairs of unbalanced proof masses rotating in reverse. Also, the torsional beam is designed as a double-beam structure, which is a symmetrical structure formed by two torsional beams separated by a certain distance. The device area of the novel accelerometer is more than 50 times smaller than that of a traditional double differential torsional MEMS accelerometer. The FEM simulation results demonstrate that the smaller device does not sacrifice other specifications, such as mechanical sensitivity, nonlinearity and temperature robustness. The mechanical sensitivity and nonlinearity of a +/- 15 g measuring range is 59.4 fF/g and 0.88%, respectively. Compared with traditional single-beam silicon structures, the novel structure can achieve lower maximum principle stress in critical regions and reduce the possibility of failure when high-g acceleration loading is applied along all three axes. The mechanical noise equivalent acceleration is about <mml:semantics>0.13mg in the theoretical calculations and the offset temperature coefficient is 0.25 mg/ in the full temperature range of -40 degrees C to 60 degrees C.
引用
收藏
页数:16
相关论文
共 36 条
[1]   A Compact Angular Rate Sensor System Using a Fully Decoupled Silicon-on-Glass MEMS Gyroscope [J].
Alper, Said Emre ;
Temiz, Yuksel ;
Akin, Tayfun .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2008, 17 (06) :1418-1429
[2]  
Andersson N., 1999, J EXT ABSTR TRANSDUC, V1, P902
[3]  
Barbour N., 1996, P AIAA GUID NAV TECH, P1
[4]   Compact biaxial micromachined resonant accelerometer [J].
Caspani, Alessandro ;
Comi, Claudia ;
Corigliano, Alberto ;
Langfelder, Giacomo ;
Tocchio, Alessandro .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2013, 23 (10)
[5]  
Dong Y., 2011, TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, P695, DOI 10.1109/TRANSDUCERS.2011.5969218
[6]   CMOS microsystems temperature control [J].
Falconi, Christian ;
Fratini, Marco .
SENSORS AND ACTUATORS B-CHEMICAL, 2008, 129 (01) :59-66
[7]   Physically-Based Reduced Order Modelling of a Uni-Axial Polysilicon MEMS Accelerometer [J].
Ghisi, Aldo ;
Mariani, Stefano ;
Corigliano, Alberto ;
Zerbini, Sarah .
SENSORS, 2012, 12 (10) :13985-14003
[8]   Polysilicon MEMS accelerometers exposed to shocks: numerical-experimental investigation [J].
Ghisi, Aldo ;
Kalicinski, Stanislaw ;
Mariani, Stefano ;
De Wolf, Ingrid ;
Corigliano, Alberto .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2009, 19 (03)
[9]  
Hak M. Gad-el, 2001, MEMS HDB, V20
[10]  
HAUCK T, 2006, P EUROSIME06 COM IT, P203