Depletion and Phase Transformation of a Submicron Ni(P) Film in the Early Stage of Soldering Reaction between Sn-Ag-Cu and Au/Pd(P)/Ni(P)/Cu

被引：14
作者：
Ho, Cheng-En [1 ]
Hsieh, Wan-Zhen [1 ]
Yang, Tsung-Hsun [1 ]
机构：
[1] Yuan Ze Univ, Dept Chem Engn & Mat Sci, Chungli, Taiwan
来源：
ELECTRONIC MATERIALS LETTERS | 2015年 / 11卷 / 01期
关键词：
Au/Pd(P)/Ni(P)/Cu; submicron Ni(P); Sn-Ag-Cu; Ni2SnP; SURFACE FINISH; INTERFACIAL REACTION; P METALLIZATION; SN-3.5AG SOLDER; THIN-FILM; THICKNESS; JOINTS; SYSTEM; LAYER; RELIABILITY;
D O I：
10.1007/s13391-014-4224-1
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The early stage of soldering reaction between Sn-3Ag-0.5Cu solder and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu pad was investigated by field-emission scanning electron microscopy (FE-SEM) in conjunction with field-emission electron probe microanalysis (FE-EPMA) and high-resolution transmission electron microscopy (HRTEM). FE-SEM, FE-EPMA, and HRTEM investigations showed that Ni2SnP and Ni3P were the predominant P-containing intermetallic compounds (IMCs) in the soldering reaction and that their growth behaviors strongly depended on the depletion of Ni(P). The growth of Ni3P dominated over that of Ni2SnP in the early stage of soldering, whereas the Ni3P gradually transformed into Ni2SnP after Ni(P) depletion. This Ni(P)-depletion-induced Ni2SnP growth behavior is different from the reaction mechanisms reported in the literature. Detailed analyses of the microstructural evolution of the IMC during Ni(P) depletion were conducted, and a two-stage reaction mechanism was proposed to rationalize the unique MC growth behavior.
引用
收藏
页码：155 / 163
页数：9
相关论文
共 27 条
[1]   THE STRUCTURE OF ELECTROLESS NI-P FILMS AS A FUNCTION OF COMPOSITION [J].
ALLEN, RM ;
VANDERSANDE, JB .
SCRIPTA METALLURGICA, 1982, 16 (10) :1161-1164
[2]   EM modeling of microstrip conductor losses including surface roughness effect [J].
Chen, Xiaoming .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2007, 17 (02) :94-96
[3]   EFFECTIVE SKIN DEPTH FOR MULTILAYER COATED CONDUCTOR [J].
Deng, H. -W. ;
Zhao, Y. -J. ;
Liang, C. -J. ;
Jiang, W. -S. ;
Ning, Y-M. .
PROGRESS IN ELECTROMAGNETICS RESEARCH M, 2009, 9 :1-8
[4]   Pronounced effects of Ni(P) thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd(P)/Ni(P)/Cu reactive system [J].
Ho, C. E. ;
Fan, C. W. ;
Hsieh, W. Z. .
SURFACE & COATINGS TECHNOLOGY, 2014, 259 :244-251
[5]   Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications [J].
Ho, C. E. ;
Wang, S. J. ;
Fan, C. W. ;
Wu, W. H. .
JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (01) :16-25
[6]   Sn-Ag-Cu solder reaction with Au/Pd/Ni(P) and Au/Pd(P)/Ni(P) platings [J].
Ho, C. E. ;
Lin, Y. C. ;
Wang, S. J. .
THIN SOLID FILMS, 2013, 544 :551-556
[7]   Field-emission transmission electron microscopy study of the reaction sequence between Sn-Ag-Cu alloy and an amorphous Pd(P) thin film in microelectronic packaging [J].
Ho, C. E. ;
Wang, C. C. ;
Rahman, M. A. ;
Lin, Y. C. .
THIN SOLID FILMS, 2013, 529 :369-373
[8]   Reliability evaluation on a submicron Ni(P) thin film for lead-free soldering [J].
Ho, C. E. ;
Fan, C. W. ;
Wu, W. H. ;
Kuo, T. T. .
THIN SOLID FILMS, 2013, 529 :364-368
[9]   Gold- and Palladium-Induced Embrittlement Phenomenon in Microbumps with Au/Pd(P)/Ni(P) Metallization Pads [J].
Ho, C. E. ;
Wu, W. H. ;
Wang, C. C. ;
Lin, Y. C. .
JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (12) :3266-3275
[10]  
Ho CE, 2012, ELECTRON MATER LETT, V8, P495
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