1200-V Normally Off GaN-on-Si Field-Effect Transistors With Low Dynamic ON-Resistance

被引:329
作者
Chu, Rongming [1 ]
Corrion, Andrea [1 ]
Chen, Mary [1 ]
Li, Ray [1 ]
Wong, Danny [1 ]
Zehnder, Daniel [1 ]
Hughes, Brian [1 ]
Boutros, Karim [1 ]
机构
[1] HRL Labs, Malibu, CA 90265 USA
关键词
Dynamic ON-resistance; field-effect transistor; field plate; GaN; gate insulator; power switch; PLATE; POWER; GANHEMTS; HEMTS;
D O I
10.1109/LED.2011.2118190
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This letter reports high-voltage GaN field-effect transistors fabricated on Si substrates. A halide-based plasma treatment was performed to enable normally off operation. Atomic layer deposition of Al(2)O(3) gate insulator was adopted to reduce the gate leakage current. Incorporation of multiple field plates, with one field plate connected to the gate electrode and two field plates connected to the source electrode successfully enabled a high breakdown voltage of 1200 V and low dynamic ON-resistance at high-voltage operation.
引用
收藏
页码:632 / 634
页数:3
相关论文
共 12 条
[1]   10-W/mm AlGaN-GaNHFET with a field modulating plate [J].
Ando, Y ;
Okamoto, Y ;
Miyamoto, H ;
Nakayama, T ;
Inoue, T ;
Kuzuhara, M .
IEEE ELECTRON DEVICE LETTERS, 2003, 24 (05) :289-291
[2]  
BOUTROS KS, 2009, IEDM DEC
[3]   High-performance enhancement-mode AlGaN/GaN HEMTs using fluoride-based plasma treatment [J].
Cai, Y ;
Zhou, YG ;
Chen, KJ ;
Lau, KM .
IEEE ELECTRON DEVICE LETTERS, 2005, 26 (07) :435-437
[4]   AlGaN/GaN HEMT grown on large size silicon substrates by MOVPE capped with in-situ deposited Si3N4 [J].
Cheng, Kai ;
Leys, M. ;
Derluyn, J. ;
Degroote, S. ;
Xiao, D. P. ;
Lorenz, A. ;
Boeykens, S. ;
Germain, M. ;
Borghs, G. .
JOURNAL OF CRYSTAL GROWTH, 2007, 298 :822-825
[5]   GaN Power Transistors on Si Substrates for Switching Applications [J].
Ikeda, Nariaki ;
Niiyama, Yuki ;
Kambayashi, Hiroshi ;
Sato, Yoshihiro ;
Nomura, Takehiko ;
Kato, Sadahiro ;
Yoshida, Seikoh .
PROCEEDINGS OF THE IEEE, 2010, 98 (07) :1151-1161
[6]   Evaluation of AlGaN/GaN heterostructure field-effect transistors on Si substrate in power factor correction circuit [J].
Iwakami, Shinichi ;
Machida, Osamu ;
Izawa, Yoshimichi ;
Baba, Ryohei ;
Yanagihara, Masataka ;
Ehara, Toshihiro ;
Kaneko, Nobuo ;
Goto, Hirokazu ;
Iwabuchi, Akio .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2007, 46 (29-32) :L721-L723
[7]   Self-aligned ALD AlOx T-gate insulator for gate leakage current suppression in SiNx-passivated AlGaN/GaN HEMTs [J].
Meyer, David J. ;
Bass, Robert ;
Katzer, D. Scott ;
Deen, David A. ;
Binari, Steven C. ;
Daniels, Kevin M. ;
Eddy, Charles R., Jr. .
SOLID-STATE ELECTRONICS, 2010, 54 (10) :1098-1104
[8]   Suppression of dynamic on-resistance increase and gate charge measurements in high-voltage GaN-HEMTs with optimized field-plate structure [J].
Saito, Wataru ;
Kakiuchi, Yorito ;
Saito, Yasunobu ;
Tsuda, Kunio ;
Omura, Ichiro ;
Yamaguchi, Masakazu .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2007, 54 (08) :1825-1830
[9]   Gate injection transistor (GIT) - A normally-off AlGaN/GaN power transistor using conductivity modulation [J].
Uemoto, Yasuhiro ;
Hikita, Masahiro ;
Ueno, Hiroaki ;
Matsuo, Hisayoshi ;
Ishida, Hidetoshi ;
Yanagihara, Manabu ;
Ueda, Tetsuzo ;
Tanaka, Tsuyoshi ;
Ueda, Daisuke .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2007, 54 (12) :3393-3399
[10]   30-W/mm GaNHEMTs by field plate optimization [J].
Wu, YF ;
Saxler, A ;
Moore, M ;
Smith, RP ;
Sheppard, S ;
Chavarkar, PM ;
Wisleder, T ;
Mishra, UK ;
Parikh, P .
IEEE ELECTRON DEVICE LETTERS, 2004, 25 (03) :117-119