Effect of currents on the microstructure of directionally solidified Al-4.5 wt% Cu alloy

被引:20
作者
Song, Changjiang [1 ]
Guo, Yuanyi [1 ]
Zhang, Yunhu [1 ]
Zheng, Hongxing [1 ]
Yan, Meng [1 ]
Han, Qingyou [2 ]
Zhai, Qijie [1 ]
机构
[1] Shanghai Univ, Sch Mat Sci & Engn, Shanghai Key Lab Modern Met & Mat Proc, Shanghai 200072, Peoples R China
[2] Purdue Univ, Mech Engn Technol Dept, W Lafayette, IN 47907 USA
关键词
Directional solidification; Interface; Morphological stability; Alloys; ELECTRIC-CURRENT PULSE; AUSTENITIC STAINLESS-STEEL; MAGNETIC-FIELD; CONVECTION; STABILITY; PLANAR; ZONE;
D O I
10.1016/j.jcrysgro.2011.03.025
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
This paper describes a comparative study on the effect of electric current pulse (ECP) and the semi-sinusoidal current (SSC) on the microstructure of directionally solidified Al-4.5 wt% Cu alloy. The experimental results indicate that both ECP and SSC can make the convex solid/liquid interface flat, reduce the primary spacing and the depth of mushy zone, and change the interface morphology from cellular to planar (i.e. delay the planar/cellular transition). Under the same heating power, SSC produces a greater influence on the microstructure than ECP. Limited effect of the current direction on microstructure is also observed. Generally, current flowing from the liquid to the solid have a stronger effect on the microstructure than those from the solid to the liquid. Possible mechanisms by which the current altes the microstructure of Al-4.5 wt% Cu alloy under directional solidification conditions are suggested. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码:235 / 242
页数:8
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