Metasurface-Programmable Wireless Network-On-Chip

被引:28
作者
Imani, Mohammadreza F. [1 ]
Abadal, Sergi [2 ]
del Hougne, Philipp [3 ]
机构
[1] Arizona State Univ, Sch Elect Comp & Energy Engn, Tempe, AZ 85287 USA
[2] Univ Politecn Cataluna, NaNoNetworking Ctr Catalunya N3Cat, ES-08034 Barcelona, Spain
[3] Univ Rennes, CNRS, IETR, UMR 6164, F-35000 Rennes, France
基金
欧盟地平线“2020”;
关键词
over-the-air equalization; programmable metasurface; smart radio environment; wave chaos; wireless communication; wireless network-on-chip; RECONFIGURABLE INTELLIGENT SURFACES; INTEGRATED ANTENNAS; MASSIVE MIMO; DESIGN; COMMUNICATION; TRANSMISSION; CHANNEL; INTERCONNECT; ARCHITECTURE; PROPAGATION;
D O I
10.1002/advs.202201458
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
This paper introduces the concept of smart radio environments, currently intensely studied for wireless communication in metasurface-programmable meter-scaled environments (e.g., inside rooms), on the chip scale. Wireless networks-on-chips (WNoCs) are a candidate technology to improve inter-core communication on chips but current proposals are plagued by a dilemma: either the received signal is weak, or it is significantly reverberated such that the on-off-keying modulation speed must be throttled. Here, this vexing problem is overcome by endowing the wireless on-chip environment with in situ programmability which enables the shaping of the channel impulse response (CIR); thereby, a pulse-like CIR shape can be imposed despite strong multipath propagation and without entailing a reduced received signal strength. First, a programmable metasurface suitable for integration in the on-chip environment ("on-chip reconfigurable intelligent surface") is designed and characterized. Second, its configuration is optimized to equalize selected wireless on-chip channels "over the air." Third, by conducting a rigorous communication analysis, the feasibility of significantly higher modulation speeds with shaped CIRs is evidenced. The results introduce a programmability paradigm to WNoCs which boosts their competitiveness as complementary on-chip interconnect solution.
引用
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页数:13
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