Numerical simulation of boiling enhancement on a microstructured surface

被引:17
作者
Lee, Woorim [1 ]
Son, Gihun [1 ]
机构
[1] Sogang Univ, Dept Mech Engn, Seoul 121742, South Korea
关键词
Boiling enhancement; Level-set method; Microstructured surface; Numerical simulation; HEAT-TRANSFER; DIELECTRIC FLUID; BUBBLE-GROWTH; DYNAMICS; VAPOR;
D O I
10.1016/j.icheatmasstransfer.2010.11.017
中图分类号
O414.1 [热力学];
学科分类号
摘要
Significant efforts have been made to augment nucleate boiling by surface modification with micro-machined structures, but a general predictive approach for heat transfer enhancement has not yet been developed. In this work, complete numerical simulations are performed for boiling enhancement on a microstructured surface by employing the sharp-interface level-set method, which is modified to handle the contact angle and the evaporative heat flux from the liquid microlayer on an immersed solid surface. The effects of cavity diameter and surface modification such as concentric grooves and multi-step cavities on bubble growth and boiling heat transfer are investigated. (C) 2010 Elsevier Ltd. All rights reserved.
引用
收藏
页码:168 / 173
页数:6
相关论文
共 18 条
  • [1] Microelectronic Cooling by Enhanced Pool Boiling of a Dielectric Fluorocarbon Liquid
    Anderson, T. M.
    Mudawar, I.
    [J]. JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1989, 111 (1-4): : 752 - 759
  • [2] Enhancement of pool boiling
    Bergles, AE
    [J]. INTERNATIONAL JOURNAL OF REFRIGERATION-REVUE INTERNATIONALE DU FROID, 1997, 20 (08): : 545 - 551
  • [3] Experiments on pool boiling of a dielectric fluid on extended surfaces
    Guglielmini, G
    Misale, M
    Schenone, C
    [J]. INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 1996, 23 (04) : 451 - 462
  • [4] Enhanced boiling heat transfer from electronic components by use of surface microstructures
    Honda, H
    Wei, JJ
    [J]. EXPERIMENTAL THERMAL AND FLUID SCIENCE, 2004, 28 (2-3) : 159 - 169
  • [5] Pool boiling heat transfer enhancement by surface modification/micro structures for electronics cooling: A review
    Khan, N
    Pinjala, D
    Toh, KC
    [J]. 6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 273 - 280
  • [6] Numerical Calculation of Bubble Growth in Nucleate Boiling From Inception Through Departure
    Lee, R. C.
    Nydahl, J. E.
    [J]. JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1989, 111 (1-4): : 474 - 479
  • [7] Bubble dynamics and heat transfer during nucleate boiling in a microchannel
    Lee, Woorim
    Son, Gihun
    [J]. NUMERICAL HEAT TRANSFER PART A-APPLICATIONS, 2008, 53 (10) : 1074 - 1090
  • [8] Numerical Analysis of Bubble Growth and Departure from a Microcavity
    Lee, Woorim
    Son, Gihun
    Jeong, Jae Jun
    [J]. NUMERICAL HEAT TRANSFER PART B-FUNDAMENTALS, 2010, 58 (05) : 323 - 342
  • [9] EFFECTS OF BOILING HISTORY ON A MICROCONFIGURED SURFACE IN A DIELECTRIC LIQUID
    MILLER, WJ
    GEBHART, B
    WRIGHT, NT
    [J]. INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 1990, 17 (04) : 389 - 398
  • [10] Study of lateral merger of vapor during nucleate pool boiling
    Mukherjee, A
    Dhir, VK
    [J]. JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2004, 126 (06): : 1023 - 1039