A cross-interface model for thermal transport across the interface between overlapped nanoribbons

被引:25
作者
Feng, Wentao [1 ,2 ]
Yu, Xiaoxiang [2 ]
Wang, Yue [2 ]
Ma, Dengke [2 ,3 ,4 ]
Sun, Zhijia [5 ]
Deng, Chengcheng [1 ,2 ]
Yang, Nuo [1 ,2 ]
机构
[1] Huazhong Univ Sci & Technol, State Key Lab Coal Combust, Wuhan 430074, Peoples R China
[2] Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430074, Peoples R China
[3] Nanjing Normal Univ, Sch Phys & Technol, NNU SULI Thermal Energy Res Ctr NSTER, Nanjing 210023, Peoples R China
[4] Nanjing Normal Univ, Sch Phys & Technol, Ctr Quantum Transport & Thermal Energy Sci CQTES, Nanjing 210023, Peoples R China
[5] Chinese Acad Sci, Inst High Energy Phys, Beijing 100049, Peoples R China
基金
中国国家自然科学基金;
关键词
CONDUCTIVITY; GRAPHENE; POLYMER; CONDUCTANCE; COMPOSITES; NANOTUBES; DEFECT;
D O I
10.1039/c9cp04694a
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The application of low-dimensional materials for heat dissipation requires a comprehensive understanding of thermal transport at cross-interfaces, which widely exist in various composite materials and electronic devices. In this work, an analytical model is proposed, named as the cross-interface model (CIM), to accurately reveal the essential mechanism of the two-dimensional thermal transport at cross-interfaces. The applicability of CIM is validated through a comparison of the analytical results with molecular dynamics simulations for a typical cross-interface between two overlapped boron nitride nanoribbons. Besides, it is found that both the thermal resistances and the factor, eta, has an important influence on the thermal transport. These investigations would deepen the understanding of the thermal transport at cross-interfaces and also facilitate the application of low-dimensional materials in thermal management.
引用
收藏
页码:25072 / 25079
页数:8
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