Embedding electronics into additive manufactured components using laser metal deposition and selective laser melting

被引：12

作者：

Petrat, Torsten ^{[1
]}

Kersting, Robert ^{[1
]}

Graf, Benjamin ^{[1
]}

Rethmeier, Michael ^{[1
,2
,3
]}

机构：

[1] Fraunhofer Inst Prod Syst & Design Technol, Pascalstr 8-9, D-10587 Berlin, Germany

[2] Fed Inst Mat Res & Testing, Unter Eichen 87, D-12205 Berlin, Germany

[3] Tech Univ Berlin, Inst Machine Tools & Factory Management, Pascalstr 8-9, D-10587 Berlin, Germany

来源：

10TH CIRP CONFERENCE ON PHOTONIC TECHNOLOGIES [LANE 2018] | 2018年 / 74卷

关键词：

additive manufacturing; condition monitoring; process chain; laser-metal-deposition; selektive-laser-melting; embedded electronics; DESIGN; REPAIR;

D O I：

10.1016/j.procir.2018.08.071

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The paper deals with the integration of a light emitting diode (LED) into an additive manufactured metal component. Selective laser melting (SLM) and laser metal deposition (LIVID) are used. The material used is the chrome-nickel steel 316L. The basic component is manufactured by means of SLM and consists of a solid body and an area with grid structure. The solid body includes a duct in the shape of a groove with a recess for the positioning of the power cable. The LED is embedded in the grid structure via an inlet from the solid body. In further processing, the groove is filled with LIVID. Two strategies with different parameter combinations were investigated. It shows that a high energy input near the power cable leads to its destruction. By using multiple parameter combinations during the manufacturing process, this destruction can be prevented. There was a comparison of both strategies with regard to the necessary number of tracks and duration of welding time. (C) 2018 The Authors. Published by Elsevier Ltd.

引用

页码：168 / 171

页数：4

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