Assessment of Broadband Shielding Effectiveness of Composite Panels for Protective Enclosures

被引：8

作者：

Clerico, Paul ^{[1
,2
]}

Pichon, Lionel ^{[1
,2
]}

Mininger, Xavier ^{[1
,2
]}

Dubrunfaut, Olivier ^{[1
,2
]}

Monsef, Florian ^{[1
,2
]}

Gannouni, Chadi ^{[1
,2
]}

He, Delong ^{[3
]}

Bai, Jinbo ^{[3
]}

Prevond, Laurent ^{[4
]}

机构：

[1] Univ Paris Saclay, Cent Supelec, CNRS, Lab Genie Elect & Elect Paris, F-91192 Gif Sur Yvette, France

[2] Sorbonne Univ, F-75252 Paris, France

[3] Univ Paris Saclay, CNRS, Lab Mecan Paris Saclay, ENS Paris Saclay,Cent Supelec, F-91190 Gif Sur Yvette, France

[4] Univ Paris Saclay, CNRS, ENS Paris Saclay, SATIE CNAM, F-91190 Gif Sur Yvette, France

来源：

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | 2022年 / 64卷 / 05期

关键词：

Steel; Numerical models; Magnetic shielding; Magnetic noise; Graphene; Three-dimensional displays; Permeability; Composite; enclosure; far-field; near-field; shiel-ding effectiveness; ELECTROMAGNETIC-INTERFERENCE;

D O I：

10.1109/TEMC.2022.3199904

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The article investigates the shielding effectiveness (SE) of a metallic enclosure with a multilayer composite cover over a wide frequency range, from near-field magnetic shielding (1 Hz-1 MHz) to far-field electromagnetic shielding (4-14 GHz). Two enclosures are considered: a conductive enclosure made of aluminum and a magnetic enclosure made of steel. The multilayer composite is a trilayer combining a thin conductive layer of graphene and a thin magnetic layer of a Fe-Ni alloy on either side of a fiberglass plate. To determine the SE of these enclosures in both low-frequency and high-frequency approaches, two experimental setups and two numerical models are developed. The use of the composite cover, instead of the metallic one, gives a similar level of SE in the far-field and a higher specific SE (i.e., SE divided by the material density) in the near-field from 1 Hz to 2 kHz. Such quantitative analysis is the first step to designing practical enclosures entirely covered with composite panels to face electromagnetic compatibility (EMC) constraints in embedded systems.

引用

页码：1750 / 1757

页数：8

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