Inspection of aggressive OPC using aerial image-based mask inspection

被引：1

作者：

Hsu, LTH ^{[1
]}

Hung, JCC ^{[1
]}

Hsieh, HC ^{[1
]}

Rosenbusch, A ^{[1
]}

Falah, R ^{[1
]}

Blumberg, Y ^{[1
]}

机构：

[1] Taiwan Semicond Mfg Co Ltd, Hsinchu, Taiwan

来源：

PHOTOMASK AND NEXT-GENERATION LITHOGRAPHY MASK TECHNOLOGY X | 2003年 / 5130卷

关键词：

aerial-image based mask inspection; 193nm technology; OPC; optical proximity correction;

D O I：

10.1117/12.504058

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

Inspection of aggressive OPC represents one of the major challenges for today's mask inspection methodologies. Systems are phased with high-density layouts, containing OPC features far below the resolution limit of conventional inspection systems. This causes large amounts of false and nuisance defects, especially on production applications. The paper presents the use of Aera193(TM), a new inspection system using aerial imaging as inspection methodology.

引用

页码：357 / 363

页数：7