Influence of the Mold Current on the Electroslag Remelting Process

被引:31
作者
Hugo, Mathilde [1 ,2 ]
Dussoubs, Bernard [1 ]
Jardy, Alain [1 ]
Escaffre, Jessica [3 ]
Poisson, Henri [3 ]
机构
[1] Univ Lorraine, Inst Jean Lamour, Lab Excellence DAMAS, CNRS,UMR 7198, Parc Saurupt,CS 50840, F-54011 Nancy, France
[2] Sopra Banking Software, Tour Manhattan, 5 Pl Iris, F-92095 La Defense, France
[3] Aubert & Duval, BP1, F-63770 Les Ancizes, France
来源
METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE | 2016年 / 47卷 / 04期
关键词
HEAT-TRANSFER; FLUID-FLOW; SOLIDIFICATION; FIELD;
D O I
10.1007/s11663-016-0694-x
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The electroslag remelting process is widely used to produce high value-added alloys. The use of numerical simulation has proven to be a valuable way to improve its understanding. In collaboration with Aubert & Duval, the Institute Jean Lamour has developed a numerical transient model of the process. The consumable electrode is remelted within a mold assumed to be electrically insulated by the solidified slag skin. However, this assumption has been challenged by some recent studies: the solidified slag skin may actually allow a part of the melting current to reach the mold. In this paper, the evolution of our model, in order to take into account this possibility, is presented and discussed. Numerical results are compared with experimental data, while several sensitivity studies show the influence of some slag properties and operating parameters on the quality of the ingot. Even, a weakly conductive solidified slag skin at the inner surface of the mold may be responsible for a non-negligible amount of current circulating between the slag and crucible, which in turn modifies the fluid flow and heat transfer in the slag and ingot liquid pool. The fraction of current concerned depends mainly on the electrical conductivities of both the liquid and solidified slag.
引用
收藏
页码:2607 / 2622
页数:16
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