Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305)

被引:2
作者
Mukhtar, M. A. Fatah M. [1 ]
Abas, Aizat [2 ]
Haslinda, M. S. [2 ]
Ani, F. Che [3 ,4 ]
Abdullah, M. Z. [5 ]
Jalar, A. [3 ]
Ismail, R. [3 ]
机构
[1] DRB Hicom Univ Automot Malaysia, Fac Engn, Pekan 26607, Pahang, Malaysia
[2] Univ Sains Malaysia, Sch Mech Engn, Engn Campus, Nibong Tebal 14300, Penang, Malaysia
[3] Univ Kebangsaan Malaysia, Inst Microengn & Nanoelect, Bangi 43600, Selangor, Malaysia
[4] Jabil Circuits, 56 Hilir Sungai Kluang 1, George Town 11900, Malaysia
[5] Univ Sains Malaysia, Sch Aerosp Engn, Engn Campus, Nibong Tebal 14300, Penang, Malaysia
来源
INTERNATIONAL CONFERENCE ON AEROSPACE AND MECHANICAL ENGINEERING (AEROMECH17) | 2018年 / 370卷
关键词
LATTICE BOLTZMANN METHOD; TIO2; NANOPARTICLES; MICROSTRUCTURE;
D O I
10.1088/1757-899X/370/1/012067
中图分类号
V [航空、航天];
学科分类号
08 ; 0825 ;
摘要
This paper presents a preliminary study of the interaction between two models of numerical simulation namely volume of fluid (VOF) and discrete phase model (DPM). The multiphase-DPM model is capable of tracking the trajectory of the TiO2 nanoparticles that has been doped in the lead free solder Sn-3.0Ag-0.5Cu (SAC305). The current model was developed based on passive surface mount component 01005 capacitor that undergoes conventional reflow process. The trajectory of the nanoparticles at 0.01, 0.05 and 0.15wt% in the molten solder is shown in the flow front of the wetted molten solder. At 0.05wt% of nanoparticles, good dispersion of nanoparticles, pressure distribution and wetting time was found. The difference in wetting time are about 3.76% and 0.46% for 0.05wt% and 0.15wt% compared to 0.01wt% nanoparticle. The trajectory of the nanoparticles are shown to move along with the wetting formation of the molten solder. The pressure distribution and velocity vector of the different weight percentage of nanoparticles are also be studied. Higher pressure distribution is found at the capacitor area and intermetallic compound (IMC) region. The higher pressure distribution projected to reduce the micro void formation and optimize the reliability of the solder joint.
引用
收藏
页数:7
相关论文
共 14 条
  • [1] Lattice Boltzmann method study of bga bump arrangements on void formation
    Abas, Aizat
    Ishak, M. H. H.
    Abdullah, M. Z.
    Ani, F. Che
    Khor, Soon Fuat
    [J]. MICROELECTRONICS RELIABILITY, 2016, 56 : 170 - 181
  • [2] Microstructure and mechanical properties of Pb-free Sn-3.0Ag-0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process
    Chellvarajoo, Srivalli
    Abdullah, M. Z.
    [J]. MATERIALS & DESIGN, 2016, 90 : 499 - 507
  • [3] Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process
    Ishak, M. H. H.
    Abdullah, M. Z.
    Abas, Aizat
    [J]. MICROELECTRONICS RELIABILITY, 2016, 65 : 205 - 216
  • [4] Prediction of Black Powder distribution in junctions using the Discrete Phase Model
    Kharoua, Nabil
    AlShehhi, Mohamed
    Khezzar, Lyes
    [J]. POWDER TECHNOLOGY, 2015, 286 : 202 - 211
  • [5] Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
    Laurila, T.
    Vuorinen, V.
    Paulasto-Krockel, M.
    [J]. MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2010, 68 (1-2) : 1 - 38
  • [6] Discrete model for simulation of char particle gasification with structure evolution
    Lin, Shanjun
    Ding, Lu
    Zhou, Zhijie
    Yu, Guangsuo
    [J]. FUEL, 2016, 186 : 656 - 664
  • [7] Computer virtual experiment on fluidized beds using a coarse-grained discrete particle method-EMMS-DPM
    Lu, Liqiang
    Xu, Ji
    Ge, Wei
    Gao, Guoxian
    Jiang, Yong
    Zhao, Mingcan
    Liu, Xinhua
    Li, Jinghai
    [J]. CHEMICAL ENGINEERING SCIENCE, 2016, 155 : 314 - 337
  • [8] Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings
    Ng, Fei Chong
    Abas, Aizat
    Gan, Z. L.
    Abdullah, M. Z.
    Ani, F. Che
    Ali, M. Yusuf Tura
    [J]. MICROELECTRONICS RELIABILITY, 2017, 72 : 45 - 64
  • [9] Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys
    Noor, Ervina Efzan Mhd
    Singh, Amares
    [J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 2014, 26 (03) : 147 - 161
  • [10] Discrete particle model for convective AL2O3-water nanofluid around a triangular obstacle
    Rashidi, Saman
    Bovand, Masoud
    Esfahani, Javad Abolfazli
    Ahmadi, Goodarz
    [J]. APPLIED THERMAL ENGINEERING, 2016, 100 : 39 - 54