Sensing electronics on ultra-thin nanocellulose sheets

被引:0
|
作者
Yuen, Jonathan [1 ]
Walper, Scott [1 ]
Zabetakis, Dan [1 ]
Daniele, Michael [2 ]
Ratna, Banahalli [1 ]
Stenger, David [1 ]
机构
[1] US Naval Res Lab, Ctr Biomol Sci & Engn, Washington, DC USA
[2] NC State Univ, Elect & Comp Engn, Raleigh, NC USA
关键词
D O I
暂无
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
224
引用
收藏
页数:1
相关论文
共 50 条
  • [31] Ultra-Thin Optical Sheets for Parallel Data Transmission of Visible Light Communications
    Yang, Xilu
    Liang, Rongqing
    Ou, Qiongrong
    Zhang, Shuyu
    IEEE ACCESS, 2017, 5 : 25923 - 25926
  • [32] Direct Bonding and Debonding of Glass Wafers for Handling of Ultra-thin Glass Sheets
    Takeuchi, Kai
    Fujino, Masahisa
    Suga, Tadatomo
    2016 International Conference on Electronics Packaging (ICEP), 2016, : 298 - 301
  • [33] Effect of blank-holder force on springback of ultra-thin copper sheets
    Ayachi, N.
    Guermazi, N.
    Manach, Py
    INTERNATIONAL DEEP-DRAWING RESEARCH GROUP CONFERENCE (IDDRG 2021), 2021, 1157
  • [34] Development of a Nakazima Test Suitable for Determining the Formability of Ultra-Thin Copper Sheets
    Ayachi, Nejia
    Guermazi, Noamen
    Pham, Cong Hanh
    Manach, Pierre-Yves
    METALS, 2020, 10 (09) : 1 - 18
  • [35] Polymer-Sandwich Ultra-Thin Silicon(100) Platform for Flexible Electronics
    Zhang, Yong-Hua
    Karthikeyan, S.
    Zhang, Jian
    CHINESE PHYSICS LETTERS, 2016, 33 (06)
  • [36] Ultra-Thin Chips for Flexible Electronics Process Technology, Characterization, Assembly and Applications
    Burghartz, J. N.
    Angelopoulos, E.
    Appel, W.
    Endler, S.
    Ferwana, S.
    Harendt, C.
    Hassan, M. -U.
    Rempp, H.
    Richter, H.
    Zimmermann, M.
    2013 IEEE INTERNATIONAL CONFERENCE OF ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2013,
  • [37] Stress analysis and thermal performance of ultra-thin heat pipes for compact electronics
    Tang H.
    Xie Y.
    Tang Y.
    Wu X.
    Wu C.
    Sun Y.
    International Communications in Heat and Mass Transfer, 2022, 139
  • [38] Polymer-Sandwich Ultra-Thin Silicon(100) Platform for Flexible Electronics
    张永华
    SKarthikeyan
    张健
    Chinese Physics Letters, 2016, 33 (06) : 90 - 93
  • [39] The calculation of magnetic induction in grain orientated ultra-thin silicon steel sheets
    Gao, Xiuhua
    Qi, Kemin
    Qiu, Chunlin
    Tian, Yanwen
    JOURNAL OF MATERIALS SCIENCE, 2007, 42 (20) : 8667 - 8670
  • [40] Heterogeneous Integration of Ultra-thin Sheets of Alternative Materials onto Silicon Substrates
    Levin, S.
    Kuang, J.
    Cox, J.
    Mayer, J. S.
    Mayer, T. S.
    DIELECTRICS FOR NANOSYSTEMS 5: MATERIALS SCIENCE, PROCESSING, RELIABILITY, AND MANUFACTURING -AND-TUTORIALS IN NANOTECHNOLOGY: MORE THAN MOORE - BEYOND CMOS EMERGING MATERIALS AND DEVICES, 2012, 45 (03): : 559 - 565