High Speed Atomic Force Microscope Observation of Polyethylene Glycol Adsorption on Au(100)

被引：2
作者：
Esaki, Rei [1 ]
Yasuda, Yohei [1 ]
Kotani, Norito [2 ]
Matsushima, Hisayoshi [1 ]
Ueda, Mikito [1 ]
机构：
[1] Hokkaido Univ, Fac Engn, Kita 13 Nishi 8, Sapporo, Hokkaido 0608628, Japan
[2] Biomol Metrol Co Ltd, Res Inst, 1-17-1 Sengen, Tsukuba, Ibaraki 3050047, Japan
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2022年 / 169卷 / 08期
关键词：
IN-SITU OBSERVATION; COPPER ELECTRODEPOSITION; CU ELECTRODEPOSITION; PEG; BEHAVIOR; DISSOLUTION; DESORPTION; DEPOSITION; AU(111); ACID;
D O I：
10.1149/1945-7111/ac876c
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Polyethylene glycol (PEG) plays an important role as an inhibitor of the electrodeposition. In this study, we investigated the potential dependence of PEG (molecular weight: 3000) adsorption and desorption processes on the gold single crystal substrate. High speed atomic force microscope (HS-AFM) was applied for observing the dynamic behaviors of the nucleation and the growth of PEG adsorption. The in situ observation was conducted at the several potentials where the cyclic voltammogram measurement showed the broad peak of the reduction current. As the applied potential became more cathodic, the adsorption morphology changed from film-like, through the sphere, to the large irregular cluster. When the potential was switched to anodic potential, HS-AFM could show the dissolution process of PEG. Finally we demonstrated the effect of the tip force by modifying the feed-back circuit of AFM.
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页数：4
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  • [1] Observation of the Behavior of Additives in Copper Electroplating Using a Microfluidic Device
    Akita, Takanori
    Tomie, Mineyoshi
    Ikuta, Ryo
    Egoshi, Haruki
    Hayase, Masanori
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 166 (01) : D3058 - D3065
  • [2] High-speed atomic force microscopy for nano-visualization of dynamic biomolecular processes
    Ando, Toshio
    Uchihashi, Takayuki
    Fukuma, Takeshi
    [J]. PROGRESS IN SURFACE SCIENCE, 2008, 83 (7-9) : 337 - 437
  • [3] Damascene copper electroplating for chip interconnections
    Andricacos, PC
    Uzoh, C
    Dukovic, JO
    Horkans, J
    Deligianni, H
    [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1998, 42 (05) : 567 - 574
  • [4] ELECTROCHEMICAL OXIDE FILM FORMATION AT NOBLE-METALS AS A SURFACE-CHEMICAL PROCESS
    CONWAY, BE
    [J]. PROGRESS IN SURFACE SCIENCE, 1995, 49 (04) : 331 - 452
  • [5] Influence of molecular weight of polyethylene glycol on microvia filling by copper electroplating
    Dow, WP
    Yen, MY
    Lin, WB
    Ho, SW
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2005, 152 (11) : C769 - C775
  • [6] Electrodeposition of Copper on a Pt(111) Electrode in Sulfuric Acid Containing Poly(ethylene glycol) and Chloride Ions as Probed by in Situ STM
    Fu, YunLin
    Pao, Te
    Chen, Sih-Zih
    Yau, ShuehLin
    Dow, Wei-Ping
    Lee, Yuh-Lang
    [J]. LANGMUIR, 2012, 28 (26) : 10120 - 10127
  • [7] In Situ Surface X-Ray Diffraction Studies of the Influence of the PEG-Cl-Complex on Homoepitaxial Electrodeposition on Cu(001)
    Golks, F.
    Gruender, Y.
    Druenkler, A.
    Roy, J.
    Stettner, J.
    Zegenhagen, J.
    Magnussen, O. M.
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2013, 160 (12) : D3165 - D3170
  • [8] Inhibition of Copper Deposition by Polyethylene Glycol and Chloride
    Huerta Garrido, M. E.
    Pritzker, M. D.
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156 (01) : D36 - D44
  • [9] Investigation of PEG adsorption on copper in Cu2+-free solution by SERS and AFM
    Jin, Ying
    Sun, Ming
    Mu, Daobin
    Ren, Xuechong
    Wang, Qingmei
    Wen, Lei
    [J]. ELECTROCHIMICA ACTA, 2012, 78 : 459 - 465
  • [10] Copper deposition in the presence of polyethylene glycol - I. Quartz crystal microbalance study
    Kelly, JJ
    West, AC
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1998, 145 (10) : 3472 - 3476
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