The role of eddy currents and nanoparticle size on AC magnetic field-induced reflow in solder/magnetic nanocomposites

被引：12

作者：

Habib, A. H. ^{[1
]}

Xu, S. ^{[1
]}

Walker, E. ^{[1
]}

Ondeck, M. ^{[1
]}

Swaminathan, R. ^{[2
]}

McHenry, M. E. ^{[1
]}

机构：

[1] Carnegie Mellon Univ, Mat Sci & Eng Dept, Pittsburgh, PA 15213 USA

[2] Intel Corp, Chandler, AZ 85226 USA

来源：

JOURNAL OF APPLIED PHYSICS | 2012年 / 111卷 / 07期

关键词：

FERRITE NANOPARTICLES; PLASMA TORCH; NANOCRYSTALS; BEHAVIOR; PACKAGE; ALLOYS;

D O I：

10.1063/1.3671407

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Magnetic nanoparticle (MNP)-based solder composites can facilitate solder reflow in AC magnetic fields. We compare power loss in a solder composite sample with MNP loading of different particle size distribution. Scaling of solder composite samples shows that, for smaller samples, power loss is not sufficient to realize solder reflow temperature. Additional heating can be derived from eddy current losses in Cu planes in the substrate board. Eddy current heating in Cu sheets of various thickness were evaluated to quantify their effect for low-temperature electronic assembly. (C) 2012 American Institute of Physics. [doi:10.1063/1.3671407]

引用

页数：3

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