Sub-0.5 nm Equivalent Oxide Thickness Scaling for Si-Doped Zr1-xHfxO2 Thin Film without Using Noble Metal Electrode

被引:37
作者
Ahn, Ji-Hoon [1 ]
Kwon, Se-Hun [2 ,3 ]
机构
[1] Inst for Basic Sci Korea, Ctr Artificial Low Dimens Elect Syst, Pohang 790784, South Korea
[2] Pusan Natl Univ, Global Frontier Ctr Hybrid Interface Mat, Busan 609735, South Korea
[3] Pusan Natl Univ, Sch Mat Sci & Engn, Busan 609735, South Korea
关键词
dielectrics; MIM capacitor; thin film; doped-oxide; atomic layer deposition; DIELECTRIC-PROPERTIES; CAPACITORS;
D O I
10.1021/acsami.5b04303
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The dielectric properties of the Si-doped Z(1-x)Hf(x)O(2) thin films were investigated over a broad compositional range with the goal of improving their properties for use as DRAM capacitor materials. The Si-doped Z(1-x)Hf(x)O(2) thin films were deposited on TiN bottom electrodes by atomic layer deposition using a TEMA-Zr/TEMA-Hf mixture precursor for deposition of Z(1-x)Hf(x)O(2) film and Tris-EMASiH as a Si precursor. The Si stabilizer increased the tetragonality and the dielectric constant; however, at high fractions of Si, the crystal structure degraded to amorphous and the dielectric constant decreased. Doping with Si exhibited a larger influence on the dielectric constant at higher Hf content. A Si-doped Hf-rich Z(1-x)Hf(x)O(2) thin film, with tetragonal structure, exhibited a dielectric constant of about SO. This is the highest value among all reported results for Zr and Hf oxide systems, and equivalent oxide thickness (EOT) value of under 0.5 nm could be obtained With a leakage current of under 10(-7) A.cm(-2), which is the lowest EOT value ever reported for a DRAM storage capacitor system without using a noble-metal-based electrode.
引用
收藏
页码:15587 / 15592
页数:6
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