Growth velocity and the topography of Ni-Zn binary alloy electrodeposits

被引:12
作者
Hiane, M [1 ]
Ebothé, J [1 ]
机构
[1] Univ Reims, UFR Sci Exactes, Unite Therm & Anal Phys, LMET,UPRES EA 2061, F-51685 Reims 02, France
关键词
D O I
10.1007/s100510170099
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
We show that the electrodeposition of Ni-Zn alloys at the lowest growth velocities, upsilon < 0.5 mum/s, exclusively proceeds from an abnormal co-deposition phenomenon. The growth process in this upsilon region greatly depends on the initial [Co2+] concentration of the film deposition bath. A theoretical approach of this process including the role of the saturation surface roughness of the alloy, o(sat), leads to an estimation of the transport properties of the ad-atoms involved during the deposit formation. Their surface diffusion coefficient varying between 1.76 x 10(-10) and 2.40 x 10(-8) cm(-2)/s exhibits a minimal value, D-s = 2.10 x 10(-10) cm(-2)/s located between upsilon = 0.17 and 0.35 mum/s. The spatial scaling analysis of the local roughness., c,, examined according to the power-law sigma = L-alpha reveals that the resulting roughness exponents concurs with the Kardar-Parisi-Zhang dynamics including the restricted surface diffusion. Two main v regions leads to different fractal textural features of the alloy film surface. Below 0.10 mum/s, the roughness exponent obtained is alpha approximate to 0.6, depicting a limited ad-atom mobility. Over upsilon = 0.30 mum/s, this exponent stabilises at alpha approximate to 0.82, indicating an increase of the surface diffusion.
引用
收藏
页码:485 / 495
页数:11
相关论文
共 41 条
  • [1] THE FORMATION, STRUCTURE AND CORROSION BEHAVIOR OF CONVERSION COATINGS ON ZINC ALLOY ELECTRODEPOSITS
    ABIBSI, A
    SHORT, NR
    DENNIS, JK
    [J]. TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1991, 69 : 45 - 49
  • [2] ELECTRODEPOSITION OF ZINC-NICKEL ALLOY COATINGS - INFLUENCE OF A PHENOLIC DERIVATIVE
    ALBALAT, R
    GOMEZ, E
    MULLER, C
    SARRET, M
    VALLES, E
    PREGONAS, J
    [J]. JOURNAL OF APPLIED ELECTROCHEMISTRY, 1990, 20 (04) : 635 - 639
  • [3] THE EVALUATION OF SURFACE-DIFFUSION COEFFICIENTS OF GOLD AND PLATINUM ATOMS AT ELECTROCHEMICAL INTERFACES FROM COMBINED STM-SEM IMAGING AND ELECTROCHEMICAL TECHNIQUES
    ALONSO, C
    SALVAREZZA, RC
    VARA, JM
    ARVIA, AJ
    VAZQUEZ, L
    BARTOLOME, A
    BARO, AM
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (07) : 2161 - 2166
  • [4] PHASE-TRANSITION IN A RESTRICTED SOLID-ON-SOLID SURFACE-GROWTH MODEL IN 2+1 DIMENSIONS
    AMAR, JG
    FAMILY, F
    [J]. PHYSICAL REVIEW LETTERS, 1990, 64 (05) : 543 - 546
  • [5] [Anonymous], ANN CIRP
  • [6] BARABASI AL, 1995, FRACTAL CONCEPT SURF
  • [7] Brenner A., 1963, ELECTRODEPOSITION AL, V2
  • [8] Brenner A., 1963, ELECTRODEPOSITION AL, V1
  • [9] Growth mode of copper films electrodeposited on silicon from sulfate and pyrophosphate solutions
    Cerisier, M
    Attenborough, K
    Fransaer, J
    Van Haesendonck, C
    Celis, JP
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1999, 146 (06) : 2156 - 2162
  • [10] Surface roughness and morphology of Co-(Fe and Ni) binary alloy electrodeposits studied by atomic force microscopy
    Ebothé, J
    Vilain, S
    [J]. JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1999, 32 (18) : 2342 - 2353