Compact and High-Density Opto-electronic Transceiver Module for Chip-to-Chip Optical Interconnects

被引：0

作者：

Mori, Tetsuya ^{[1
]}

Fujiwara, Makoto ^{[1
]}

Terada, Shinsuke ^{[1
]}

Choki, Koji ^{[1
]}

机构：

[1] Sumitomo Bakelite Co Ltd, Circuitry Opt Interconnect Business Dev Dept, Utsunomiya, Tochigi, Japan

来源：

2011 OPTICAL FIBER COMMUNICATION CONFERENCE AND EXPOSITION (OFC/NFOEC) AND THE NATIONAL FIBER OPTIC ENGINEERS CONFERENCE | 2011年

关键词：

D O I：

暂无

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

We fabricated an opto-electronic transceiver module on a flexible printed circuit board without using a lens array. 10Gbps data transmission through polynorbornene-based waveguide is achieved with low inter-channel cross talk.

引用

页数：3

共 5 条

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