Special Section on Formal Approach FOREWORD

被引：0

作者：

Yuen, Shoji ^{[1
,2
,3
]}

机构：

[1] Nagoya Univ, Grad Sch Informat Sci, Nagoya, Aichi 4648601, Japan

[2] Nagoya Univ, Ctr Informat Media Studies, Nagoya, Aichi 4648601, Japan

[3] Nagoya Univ, Grad Sch Engn, Nagoya, Aichi 4648601, Japan

来源：

IEICE TRANSACTIONS ON INFORMATION AND SYSTEMS | 2012年 / E95D卷 / 05期

关键词：

D O I：

10.1587/transinf.E95.D.1341

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：1341 / 1341

页数：1

共 50 条

[31] Foreword - Special section on microoptomechatronics
Kaneko, Shun-ichi
Katagiri, Yoshitada
Higurashi, Eiji
IEICE TRANSACTIONS ON ELECTRONICS, 2007, E90C (01) : 1 - 2
[32] Foreword - Special section on imaging
Bertero, M
Scherzer, O
INVERSE PROBLEMS, 2003, 19 (06)
[33] Special section on bifurcations FOREWORD
Saito, Toshimichi
IEICE NONLINEAR THEORY AND ITS APPLICATIONS, 2012, 3 (04): : 457 - 457
[34] SPECIAL SECTION ON RELIABILITY - FOREWORD
NAKAMURA, K
IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS COMMUNICATIONS AND COMPUTER SCIENCES, 1994, E77A (01) : 107 - 108
[35] SPECIAL SECTION ON QUALITY - FOREWORD
MEESTER, S
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1994, 17 (01): : 141 - 141
[36] Foreword to the Special Section on Education
Miyai, Ayumi
Baranoski, Gladimir V. G.
COMPUTERS & GRAPHICS-UK, 2010, 34 (06): : 779 - 779
[37] Special Section on Nanopackaging Foreword
Raj, P. Markondeya
Mahajan, Ravi
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016, 6 (12): : 1731 - 1732
[38] Foreword - Polytronic special section
Morris, JE
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2005, 28 (04): : 741 - 741
[39] SPECIAL SECTION ON PACKAGING - FOREWORD
BALDE, JW
SEGELKEN, JM
KNAUSENBERGER, WH
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1992, 15 (01): : 5 - 6
[40] Special Section on Genomics Foreword
Dominguez, Virginia R.
Malhi, Ripan S.
AMERICAN ANTHROPOLOGIST, 2018, 120 (02) : 328 - 329

← 1 2 3 4 5 →